A 1.2 TB/s on-chip ring interconnect for 45nm 8-core enterprise Xeon® processor

Cheolmin Park,Roy Badeau,Larry Biro,Jonathan Chang,Tejpal Singh,Jim Vash,Bo Wang,Tom Wang
DOI: https://doi.org/10.1109/ISSCC.2010.5434000
2010-01-01
Abstract:A 1.2 TB/s ring interconnect implemented with a 9 metal 45 nm technology is described. The implementation provides on-die communication for 8 Xeon cores, 8-port parallel-access 24 MB L3 cache, and 2 system-interface ports. The efficient, flexible, and modular building-block approach used to construct our design is described.
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