Pascal Vivet,Eric Guthmuller,Yvain Thonnart,Gael Pillonnet,César Fuguet,Ivan Miro-Panades,Guillaume Moritz,Jean Durupt,Christian Bernard,Didier Varreau,Julian Pontes,Sébastien Thuries,David Coriat,Michel Harrand,Denis Dutoit,Didier Lattard,Lucile Arnaud,Jean Charbonnier,Perceval Coudrain,Arnaud Garnier,Frédéric Berger,Alain Gueugnot,Alain Greiner,Quentin L. Meunier,Alexis Farcy,Alexandre Arriordaz,Séverine Chéramy,Fabien Clermidy,Cesar Fuguet,Sebastien Thuries,Frederic Berger,Severine Cheramy

Abstract:In the context of high-performance computing, the integration of more computing capabilities with generic cores or dedicated accelerators for artificial intelligence (AI) application is raising more and more challenges. Due to the increasing costs of advanced nodes and the difficulties of shrinking analog and circuit input output signals (IOs), alternative architecture solutions to single die are becoming mainstream. Chiplet-based systems using 3D technologies enable modular and scalable architecture and technology partitioning. Nevertheless, there are still limitations due to chiplet integration on passive interposers—silicon or organic. In this article we present the first CMOS active interposer, integrating: 1) power management without any external components; 2) distributed interconnects enabling any chiplet-to-chiplet communication; and3) system infrastructure, design-for-test, and circuit IOs. The IntAct circuit prototype integrates six chiplets in FDSOI 28-nm technology, which are 3D-stacked onto this active interposer in 65-nm process, offering a total of 96 computing cores. Full scalability of the computing system is achieved using an innovative scalable cache-coherent memory hierarchy, enabled by distributed network-on-chips, with 3-Tbit/s/mm<sup>2</sup> high bandwidth 3D-plug interfaces using 20- $mu text{m}$ pitch micro-bumps, 0.6-ns/mm low latency asynchronous interconnects, while the six chiplets are locally power-supplied with 156-mW/mm2 at 82%-peak-efficiency dc–dc converters through the active interposer. Thermal dissipation is studied showing the feasibility of such approach.

A Scalable And Reconfigurable 2.5d Integrated Multicore Processor On Silicon Interposer

A Scalable Network-on-Chip Microprocessor With 2.5D Integrated Memory and Accelerator.

Design of a Media-Enhanced and Reconfigurable RISC ,Microprocessor

A 65nm 39GOPS/W 24-Core Processor with 11tb/s/w Packet-Controlled Circuit-Switched Double-Layer Network-on-chip and Heterogeneous Execution Array

A novel multi-core processor for communication applications

A 101.4 GOPS/W Reconfigurable and Scalable Control-Centric Embedded Processor for Domain-Specific Applications

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

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A 16-Core Processor With Shared-Memory and Message-Passing Communications

An 800mhz 320mw 16-Core Processor with Message-Passing and Shared-Memory Inter-Core Communication Mechanisms

Design and Chip Implementation of a Heterogeneous Multi-Core DSP

Low-Power Multicore Processor Design With Reconfigurable Same-Instruction Multiple Process

A Scalable Die-to-Die Interconnect with Replay and Repair Schemes for 2.5D/3D Integration

A 60 Gb/s-Level Coarse-Grained Reconfigurable Cryptographic Processor With Less Than 1-W Power

Novel many-core architecture design for real-time image processing

A 6.4-Gbps 0.41-Pj/b Fully-Digital Die-to-die Interconnect PHY for Silicon Interposer Based 2.5D Integration

YHFT-QDSP: High-Performance Heterogeneous Multi-Core DSP

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A Reconfigurable Multi-Processor Soc For Media Applications

A 167-Processor Computational Platform in 65 Nm CMOS

A 5.6-89.9TOPS/W Heterogeneous Computing-in-Memory SoC with High-Utilization Producer-Consumer Architecture and High-Frequency Read-Free CIM Macro.