Precision Cutting Technology of Solar Wafer and Characteristic Research

Feng LIN,Jian-ping WANG,Jian-zhong FU

DOI: https://doi.org/10.3969/j.issn.1003-5451.2010.01.004

2010-01-01

Abstract:On the basis of the current solar wafer cutting technology and its characteristics,the numerical control ultrasonic vibration cutting solar wafer technology was presented to provide a practical method of processing for the precision cutting of solar wafer.

What problem does this paper attempt to address?

Research Progress on Wafer Laser Cutting Technology

Hai'ou Li,Chunrong Wei,Xiaofeng Wang,Zichen Zhang,Lingfeng Pan,Qi Li,Yonghe Chen

DOI: https://doi.org/10.13290/j.cnki.bdtjs.2017.08.001

2017-01-01

Abstract:The development process of the wafer cutting technology in semiconductor field is summarized.The characteristics,working principles,advantages and disadvantages of some cutting technologies are introduced,such as blade cutting technology,traditional laser cutting technology,new laser cutting technology and shaping laser cutting technology.The research results obtained by using the wafer cutting technology at home and abroad and its application prospects are also introduced.Comparing with the blade cutting technology,the laser cutting technology has the advantages of good cutting quality and fast cutting speed and so on.Several types of shaping laser cutting techniques,including micro-water guided laser cutting technology,stealth cutting technology,multifocal beam cutting,"line focusing"cutting,flat-top beam cutting and muhi-beam cutting to further improve the quality of wafer cutting and the cutting speed are introduced in detail.With the continuous improvement of technology and cutting equipment,shaping laser cutting technology will have a broad application prospect in the future wafer cutting field.
Design and Experimental Study of an Ultrasonic Generator for Precision Vibration Cutting

LU Zesheng,YANG Liang,SONG Zheng

DOI: https://doi.org/10.3969/j.issn.1001-3881.2007.08.011

2007-01-01

Abstract:Precision ultrasonic vibration cutting is a non-traditional machining method whose study is in growing phase in China.In order to solve vibration-generated problem and meet expectation of precision machining,an ultrasonic generator for precision numerical control machine was developed,its function is generating ultrasonic vibration.Design and simulation study was carried out.Vibration cutting experimental was made.
Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Ansheng Li,Shunchang Hu,Yu Zhou,Hongyan Wang,Zhen Zhang,Wuyi Ming

DOI: https://doi.org/10.3390/mi14081512

IF: 3.4

2023-07-28

Micromachines

Abstract:Due to the brittleness of silicon, the use of a diamond wire to cut silicon wafers is a critical stage in solar cell manufacturing. In order to improve the production yield of the cutting process, it is necessary to have a thorough understanding of the phenomena relating to the cutting parameters. This research reviews and summarizes the technology for the precision machining of monocrystalline silicon using diamond wire sawing (DWS). Firstly, mathematical models, molecular dynamics (MD), the finite element method (FEM), and other methods used for studying the principle of DWS are compared. Secondly, the equipment used for DWS is reviewed, the influences of the direction and magnitude of the cutting force on the material removal rate (MRR) are analyzed, and the improvement of silicon wafer surface quality through optimizing process parameters is summarized. Thirdly, the principles and processing performances of three assisted machining methods, namely ultrasonic vibration-assisted DWS (UV-DWS), electrical discharge vibration-assisted DWS (ED-DWS), and electrochemical-assisted DWS (EC-DWS), are reviewed separately. Finally, the prospects for the precision machining of monocrystalline silicon using DWS are provided, highlighting its significant potential for future development and improvement.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Research on Magnetorheological Ultra Precision Processing Technology and Key Technologies for Semiconductor Wafers

Junye Li,Jiaxu Tang,Jun Zhang,Xiao Li,Bin Li,Qingxin Meng,Ping Jiang,Jinbao Zhu

DOI: https://doi.org/10.21203/rs.3.rs-4119621/v1

2024-01-01

Abstract:Abstract As a key process in the manufacturing of integrated circuit chips, the quality and effectiveness of wafer cutting directly affect the performance of the chip. Magnetorheological machining is a flexible machining technique that changes the rheological properties of polishing fluid through internal gradient electromagnetic fields, thereby achieving material removal and surface error correction. This article focuses on magnetorheological machining technology and conducts simulation and experimental research on wafers. By simulating the mechanical properties of the wafer surface under different polishing disc speeds, excitation gaps and particle sizes, the simulation obtained the optimal processing parameters through experiments and data analysis, and finally obtained a smooth wafer surface with a surface roughness of Ra 0.042 µm.
Key Techniques of Ultra-precision Cutting of Microstructure Surface

杨元华,陈时锦,段耀凯,程凯

DOI: https://doi.org/10.3969/j.issn.1003-5451.2007.03.002

2007-01-01

Abstract:Ultra-precision cutting of microstructure surface can offer many capabilities which other methods don't have. The key techniques of it was summarized. The difficulties and developing trends of this field were presented.
Investigations on the effect of ultrasonic vibration on fibre fracture and removal mechanism in cutting of fibre reinforced silicon carbide ceramic matrix composites

Weiwei Yu,Jie Chen,Qinglong An,Weiwei Ming,Ming Chen

DOI: https://doi.org/10.1016/j.jmapro.2023.03.049

IF: 5.684

2023-04-07

Journal of Manufacturing Processes

Abstract:To clarify the effectiveness of ultrasonic vibration-assisted cutting (UVAC) technology for improving the surface quality of FRCMCs-SiC, it is necessary to have a deep understanding of fibre fracture and removal mechanism of UVAC. The paper focuses on the feasibility and effect of UVAC technology on improving the machined surface quality of FRCMCs-SiC combining finite element model (FEM). The results show that applying ultrasonic vibration (UV) along the cutting direction, whether in the micro brittle fracture regime or the macro brittle fracture regime, is beneficial to reduce the cutting force, the machined surface roughness and the depth of the subsurface damage. When UV is applied perpendicular to the cutting direction, it can promote fibre fracture in the macro brittle fracture regime and reduce the depth of the subsurface damage, but deteriorate the machined surface quality in the micro brittle fracture regime.

engineering, manufacturing
Finite element simulation and experimental research on microcutting mechanism of single crystal silicon

Bing Liu,Shuwen Li,Rui Li,Cheng Chen,Lin Liang

DOI: https://doi.org/10.1007/s00170-020-05938-y

IF: 3.563

2020-08-17

The International Journal of Advanced Manufacturing Technology

Abstract:Microcutting technology, which has been proven to be an indispensable means for investigating the material removal mechanism, is able to realize the high efficiency processing of brittle materials with an ultrasmooth surface and a low-damage subsurface. In this study, a series of simulations were performed by finite element (FE) method to investigate the microcutting mechanism of the typical semiconductor material, single crystal silicon. The FE cutting models were established in terms of the Johnson–Cook constitutive relation. First, the material removal behavior during the microcutting process was studied. The results indicated that the chip formation was dominated by extrusion rather than shearing action, and both sides of the chips were smooth without any wrinkle or shear band. Then, the cutting force and cutting heat during the microcutting process were analyzed in deep. It was determined that when the cutting characteristic size reduced to less than the tool edge radius, much energy was needed to remove the materials per unit volume. Besides, microcutting experiments were conducted using a specially designed cutting platform in a scanning electron microscope, and the experimental results were observed to be in agreement with the FE simulation results.
Research on Single Cell Precision Cutting Technology Based on Piezoelectric Ultrasonic Vibration

Xiwei Gao,Haibo Huang,Liguo Chen,Su Yan,Yaqing Li,Lining Sun

DOI: https://doi.org/10.1109/robio.2018.8665299

2018-01-01

Abstract:The paper studies the key techniques of precision cutting of the zona pellucida (ZP) on single-cell level. The article first studies the composition of the ZP and the existing cutting methods, and draws the main difficulties of the cutting process. First, the oocyte is an elastomer, which is prone to deformation during the cutting process and cannot be accurately positioned. Second, because individual cells are smaller in size than soft tissues, large lateral amplitudes during ultrasonic cutting can easily cause cell collapse. Aiming at this problem, this paper proposes a new type of the ZP targeted region auxiliary support and quantitative suction cutting method. Based on this method, this paper first proposes a ZP holding scheme based on microscopic visual feedback for dual-arm auxiliary support and quantitative suction. Secondly, aiming at the single-cell minimally invasive and micro-deformation cutting requirements, this paper innovatively proposes a ZP ultrasonic cutting instrument based on flexible guiding mechanism. According to the harmonic response analysis, the lateral amplitude of the tip of the cutting instrument designed by this paper is significantly smaller than that of the traditional cutting instrument, and its minimum displacement is close to 1μm, which satisfies the safe, efficient and accurate experimental requirements.
Numerical analysis of physical quantities during ultrasonic vibration assisted cutting of SiCp/Al composites

Hongmei Chen,Chongchuang Xue,Tongxu Ge,Mingming Lu,Wenqing Wei,Jinghong Yang,Jiakang Zhou

DOI: https://doi.org/10.1177/09544054241272891

2024-09-22

Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture

Abstract:Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, Ahead of Print. The turning process of SiCp/Al composites is challenging due to the inhomogeneity and complex interaction between different phases. Ultrasonic vibration-assisted cutting (UVAC) technology is one of the effective methods to improve the machinability of SiCp/Al composites, but it is still necessary to clarify the influence of ultrasonic impact effect on related physical quantities. In this paper, numerical methods and systematic cutting experiments are used to study the evolution of various physical quantities and their impact on machinability during UVAC for SiCp/Al composites. Firstly, the UVAC process is abstracted into an ultrasonic impact behavior, enabling the identification of impact parameters acting on the machined surface per unit time. Then, a 3D finite element model of equivalent homogeneous SiCp/Al composites is established to simulate the impact process. This model facilitates a comprehensive analysis of key parameters such as the process system energy, plastic deformation, stress distribution, and hydrostatic pressure. Finally, the evolution laws of physical quantities related to UVAC of SiCp/Al composites and their influence on surface quality are analyzed. The results show that the impact effect induced by UVAC changes the stress state of the machined surface and increases the average surface microhardness by 6.7%. Moreover, the presence of high compressive hydrostatic pressure in plastic deformation zone is conducive to densifying the subsurface and reducing the surface roughness by approximately 30%. These insights provide valuable theoretical guidance for the precision turning and surface treatment process of SiCp/Al composites.

engineering, mechanical, manufacturing
Experimental Research on the Supply of Working Fluid for Fixed Diamond Wire Slicing Based on Ultrasonic Capillary Effect

Junying Zhao,Luqi Shen,Chunwei Zhang,Yanqing Wang

DOI: https://doi.org/10.3390/mi15070910

IF: 3.4

2024-07-14

Micromachines

Abstract:Thin wafers and thin wires are beneficial to the photovoltaic industry for reducing costs, increasing efficiency, and reducing the cost of electricity generation. It is a development trend in solar silicon wafer cutting. Thin wire cutting reduces the kerf between silicon wafers to less than 50 μm. Therefore, it is extremely difficult to supply cutting fluid to the cutting area. And this affects cutting performance. This paper proposes the use of the capillary effect produced by ultrasonic waves in fixed diamond wire slicing to improve the cutting fluid supply and reduce wafer adsorption. To explore the rules of ultrasonic capillary action between two plates and guide the industrial applications, the effects of the distance between parallel plates, the distance from the bottom of the parallel plates to the ultrasonic radiation surface, the non-parallelism between the plates, the temperature of the working fluid, the ultrasonic action time, and the type of working fluid on the liquid level rise height were studied. The conclusions can be used to guide the improvement of the supply of working fluid in fixed diamond wire slicing.

nanoscience & nanotechnology,instruments & instrumentation,physics, applied,chemistry, analytical
Surface morphology formation mechanism of UVA turning process based on a newly modified methodology

Guoliang Liu,Jintao Zheng,Jin Wang,Min Ji,Dexiang Wang,Xinfu Liu,Shufeng Sun,Xiangyu Wang

DOI: https://doi.org/10.1016/j.jmapro.2024.02.018

IF: 5.684

2024-02-17

Journal of Manufacturing Processes

Abstract:Ultrasonic vibration-assisted (UVA) cutting is an ideal technology to machine aeronautical materials and fabricate functional surface microstructures. Surface morphology simulation is a key method for optimizing technology parameters and obtaining desired microstructures and surface quality. In current work, a modified methodology modelling the cutting edge profile and the elastic recovery process is developed to simulate the UVA turning surface morphology. It is confirmed by cutting experiments that the proposed methodology can predict the surface roughness and microstructure sizes accurately. The surface morphology formation mechanism of UVA face turning process with different vibration directions are also investigated. The UVA face turning process with tooltip vibrating in feed direction or simultaneously in both cutting and feed directions can produce better surface quality than the conventional cutting, especially under the combination of low cutting speed and large feed rate. With respect to the high cutting speed with small feed rate condition, the tooltip vibration in all directions will increase the surface roughness than the conventional cutting process.

engineering, manufacturing
Precision treatment of silicon wafer edge utilizing ultrasonically assisted polishing technique

N. Kobayashi,Y. Wu,M. Nomura,T. Sato

DOI: https://doi.org/10.1016/j.jmatprotec.2007.11.220

IF: 6.3

2008-01-01

Journal of Materials Processing Technology

Abstract:In our previous works, a new polishing approach and apparatus for silicon wafer edge treatment with ultrasonically assisted polishing (UAP) was proposed. In this paper, a novel polishing apparatus and method were presented for more effectively performing the edge polishing based on our previous works. The fundamental polishing characteristics of the novel method were demonstrated through a few experimental investigations carried out on the new apparatus. Because of an elliptic ultrasonic vibration of the polishing pad, abrasive particles within the slurry held by the pad impact the work surface at an extremely high acceleration. It leads to the high material removal rate and the good surface quality even at low rotational speed of the wafer or small supplying flow of slurry. The novel method is suitable for the fragile wafer edge polishing. By setting proper parameters, the surface roughness of wafer edge polished by the presented method is improved over 31.7% compared to that without UAP. The polishing effect of the novel polishing method can be further improved by applying high AC voltage.
Finite element analysis and experimental study on the cutting mechanism of SiCp/Al composite in laser ultrasonic elliptic vibration turning

Chenyang Xia,Jieqiong Lin,Mingming Lu,Xuejian Zhang,Shuang Chen

DOI: https://doi.org/10.1016/j.mtcomm.2024.110389

IF: 3.8

2024-09-15

Materials Today Communications

Abstract:SiCp/Al composites have excellent material properties and are increasingly being used in the aerospace, military, and electronic packaging industries. However, the inhomogeneity and non-conductivity of conventional turning (CT) results in poor material surface quality and high cutting forces, which seriously hinder the application of particlereinforced metal matrix composites. The thermal softening property of laser-assisted turning (LAT) and the intermittent cutting property of two-dimensional (2D) ultrasonic elliptical vibratory turning (UEVT) offer unique advantages in improving material surface quality. Therefore, a novel laser ultrasonic elliptical vibratory turning (LUEVT) machining technique is proposed to improve the machining of SiCp/Al composites with two different volume fractions. The effect of highfrequency intermittent machining on material processing was further investigated by adjusting the pulsed laser power. Finite element modelling was used to predict the machining state, surface roughness, and chip morphology between the workpiece and the PCD tool. The effects of varying the machining parameters during the experiment on the two composites were analysed. The results showed that the LUEVT of 25 % and 45 % SiCp/Al composites were reduced by 39.3 % and 30.7 % respectively compared to the CT cutting forces. The experiments verified the consistency of the surface roughness and chip morphology with the finite element simulation results. The stability of the cutting force during the cutting process is also improved, as the material removal process mainly takes the form of small particle fragmentation and matrix encapsulation.

materials science, multidisciplinary
Mechanism of Surface Formation of Silicon Wafer Processed by Fixed Abrasive Polishing with Assistance of Ultrasonic Vibration and Experiments

Zeng Yifan,Yang Weiping,Wu Yongbo,Liu Manli

DOI: https://doi.org/10.3969/j.issn.1004-132X.2016.23.014

2016-01-01

Abstract:Herein,based on the characteristics of higher machining efficiency and higher surface quality of ultrasonic vibration machining,a novel ultrasonic assisted fixed abrasive CMP(UFP)tech-nique for silicon wafer was presented.The establishment of the experimental system for composite polishing was discussed in detail.In addition,the surface morphology and the material removal mech-anism were investigated based on experiments and theory.Both of the theoretical model and experi-mental results show that with the assistance of ultrasonic vibration,the surface quality is enhanced, the material removal rate (MRR)increases,and the quality of polished surface decreases with increa-ses of the polishing force,but the MRR increases.
Simulation and Experimental Research on Water-Jet Guided Laser Cutting Silicon Wafer

Wang Yang,Li Ling,Yang Lijun,Liu Bei,Wang Zhe

DOI: https://doi.org/10.1109/icept.2008.4607108

2008-01-01

Abstract:Silicon wafer cutting is a key process in wafer manufacturing. Traditional cutting methods can not do this work well, but water-jet guided laser processing which is based on the principle of full reflection can do it perfectly. A new simulation model of water-jet guided laser cutting silicon wafer was set up. The model treated the uniform energy input of water-jet guided laser, the cooling effect of the water jet, and the melting and removal of the silicon. The simulation results revealed that the effect of water jet cooling on wafer temperature field is very distinct. Machining silicon wafer, stainless steel1Cr18Ni9Ti and 65 Mn were simulated. The results showed silicon wafer had the least heat affected zone of all. Experiments were done using the new water-jet guided laser micromachining system. The results showed that the energy intensity distributed over the water jet cross section nearly homogeneous and the energy decreased little in long working distance. Applying optimized machining parameters to cut silicon wafer, nearly no burrs, no cracks, no heat affected zone were formed, the cutting results were better than diamond saw and gas (Ar) assisted laser cutting.
Experimental and simulation investigation of ultrasonic elliptical vibration cutting of tungsten alloys in ultra-precision machining

Sen Yin,Wai Sze Yip,Zhigang Dong,Renke Kang,Suet To

DOI: https://doi.org/10.1016/j.jmrt.2024.12.026

IF: 6.267

2024-12-08

Journal of Materials Research and Technology

Abstract:Ultrasonic elliptical vibration cutting (UEVC) offers the benefits of extending tool life and enhancing surface finish, enabling ultra-precision machining of hard-brittle tungsten alloys. Exploring the effect of vibration directions on UEVC of tungsten alloys has important implications for an improvement of machining quality. In this study, the vibration factors of UEVC are investigated individually, and kinematic models of various Ultrasonic vibration cutting (UVC) are established. Finite element modeling (FEM) reveals that ultrasonic vibration can decrease the cutting force to varying degrees and increase the strain rate in the tungsten alloys cutting zone up to 1.8E5 s -1 , with the effect of elliptical locus being the most prominent. Finally, an examination of the surface microstructures and chip formation of UVC on tungsten alloys reveals that it facilitates plastic material removal and increases material plasticity, which advances the understanding of the machining techniques utilized to achieve the ultra-smooth surface of tungsten alloys using UEVC.

materials science, multidisciplinary,metallurgy & metallurgical engineering
Theoretical and experimental investigation of ultrasonic cutting kinematics and its effect on chip formation and surface generation in high-frequency ultrasonic vibration-assisted diamond cutting

Canbin Zhang,Xiaoliang Liang,Chi Fai Cheung,Chunjin Wang,Benjamin Bulla

DOI: https://doi.org/10.1016/j.jmrt.2024.04.266

IF: 6.267

2024-05-04

Journal of Materials Research and Technology

Abstract:Ultrasonic vibration-assisted cutting (UVAC) is regarded as a feasible technology to machine difficult-to-cut materials. High-frequency ultrasonic vibration-assisted cutting (HFUVAC), with a working frequency of more than low and medium frequency (20-60kHz), has been reported to improve material machinability and prolong tool life. This paper presents a comprehensive investigation of the ultrasonic cutting kinematics and the generated chip/surface formation process in HFUVAC of a 316l stainless steel workpiece. First, the ultrasonic cutting kinematics was analyzed and verified by comparing the experimental and theoretical surface texture under different nominal cutting speeds. Based on the ultrasonic cutting kinematics and the simulated strain/stress distributions, the chip and surface formation between conventional cutting (CC) and HFUVAC was analyzed. More importantly, the incremental cutting mode was defined when the cutting stroke, namely the effective cutting length in one vibration cycle was less than 800 nm. The results show that in the incremental cutting mode, defect-free surface was achieved due to suppressed large deformation and friction action. Finally, HFUVAC of the sinusoidal microstructure was performed under the incremental cutting mode, achieving optical requirements with nanometer-scale surface roughness and submicrometric form accuracy, which validates the technical feasibility in HFUVAC of micro-structured surfaces.

materials science, multidisciplinary,metallurgy & metallurgical engineering
Ultraprecision Machining of Tungsten Alloy by Applying Ultrasonic Elliptical Vibration Cutting

R. Hino,S. Hamada,M. Haritani,N. Suzuki,E. Shamoto,Ji-bin Yang,Zhen-gua Yan

DOI: https://doi.org/10.2493/JJSPE.73.360

2007-03-05

Abstract:‘Ultrasonic elliptical vibration cutting’ technology is applied in the present research to ultraprecision machining of tungsten alloy, which is expected as a material of molds for glass parts instead of sintered tungsten carbide or CVD-silicon carbide. It is confirmed that ulptraprecision grooving of the tungsten alloy cannot be realized by the ordinary cutting. On the other hand, it can be realized by the elliptical vibration cutting at a cutting depth of less than 0.8 μm. Effects of the cutting distance on the cutting force and the surface roughness are also clarified, and it is found that surface roughness of less than 100 nm Rz can be attained up to a cutting distance of 35 m. Practical molds of the tungsten alloy for spherical glass lenses and a glass prism are successfully machined by the elliptical vibration cutting.

Engineering,Materials Science
A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation

Houfu Dai,Jingjing Chen,Guojie Liu

DOI: https://doi.org/10.1088/2053-1591/ab0ccb

IF: 2.025

2019-03-20

Materials Research Express

Abstract:Molecular dynamics (MD) simulation is used to study the subsurface quality and material removal ofsingle crystal silicon with a diamond tool during ultrasonic elliptical vibration assisted cutting(UEVAC), 1D ultrasonic vibration assisted cutting (1D UVAC) and traditional cutting (TC) process. Inthe simulations, a long-range analytical bond order potential is used to describe the interactioninside the silicon specimen, providing a more accurate depiction of the atomic scale mechanisms ofductile plasticity, brittle fracture, and structural changes in silicon. The results show that UEVACand 1D UVAC in cutting brittle material silicon causes a much smaller cutting force, much lower vonMises stress at the subsurface, larger material remove rate, lower compressive normal stress ##IMG##[http://ej.iop.org/images/2053-1591/6/6/065908/mrxab0ccbieqn1.gif] {${\sigma }_{xx}$} and ##IMG##[http://ej.iop.org/images/2053-1591...] {${\sigma }_{yy},$}

materials science, multidisciplinary
A Fundamental Investigation on Ultrasonic Assisted Fixed Abrasive CMP (UF-CMP) of Silicon Wafer

Yong Bo Wu,Li Jun Wang

DOI: https://doi.org/10.4028/www.scientific.net/amr.983.208

2014-01-01

Advanced Materials Research

Abstract:Chemical mechanical polishing (CMP) is often employed to obtain a super smooth work-surface of a silicon wafer. However, as a conventional CMP is a loose abrasive process, it is hard to achieve the high profile accuracy and lots of slurry must be supplied during CMP operations. As an alternate solution, a fixed abrasive CMP process can offer better geometrical accuracy and discharges less waste disposal. In this paper, in order to enhance the polishing efficiency and improve the work-surface quality, a novel ultrasonic assisted fixed abrasive CMP (UF-CMP) is proposed and the fundamental machining characteristics of the UF-CMP of a silicon wafer is investigated experimentally. The results show that with the ultrasonic assistance, the material removal rate (MRR) is increased, and the surface quality is improved.

Precision Cutting Technology of Solar Wafer and Characteristic Research

Research Progress on Wafer Laser Cutting Technology

Design and Experimental Study of an Ultrasonic Generator for Precision Vibration Cutting

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Research on Magnetorheological Ultra Precision Processing Technology and Key Technologies for Semiconductor Wafers

Key Techniques of Ultra-precision Cutting of Microstructure Surface

Investigations on the effect of ultrasonic vibration on fibre fracture and removal mechanism in cutting of fibre reinforced silicon carbide ceramic matrix composites

Finite element simulation and experimental research on microcutting mechanism of single crystal silicon

Research on Single Cell Precision Cutting Technology Based on Piezoelectric Ultrasonic Vibration

Numerical analysis of physical quantities during ultrasonic vibration assisted cutting of SiCp/Al composites

Experimental Research on the Supply of Working Fluid for Fixed Diamond Wire Slicing Based on Ultrasonic Capillary Effect

Surface morphology formation mechanism of UVA turning process based on a newly modified methodology

Precision treatment of silicon wafer edge utilizing ultrasonically assisted polishing technique

Finite element analysis and experimental study on the cutting mechanism of SiCp/Al composite in laser ultrasonic elliptic vibration turning

Mechanism of Surface Formation of Silicon Wafer Processed by Fixed Abrasive Polishing with Assistance of Ultrasonic Vibration and Experiments

Simulation and Experimental Research on Water-Jet Guided Laser Cutting Silicon Wafer

Experimental and simulation investigation of ultrasonic elliptical vibration cutting of tungsten alloys in ultra-precision machining

Theoretical and experimental investigation of ultrasonic cutting kinematics and its effect on chip formation and surface generation in high-frequency ultrasonic vibration-assisted diamond cutting

Ultraprecision Machining of Tungsten Alloy by Applying Ultrasonic Elliptical Vibration Cutting

A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation

A Fundamental Investigation on Ultrasonic Assisted Fixed Abrasive CMP (UF-CMP) of Silicon Wafer