Heat Transfer Investigation of Miniature Flat Heat Loop Pipe Evaporator for Heat Dissipation of Electronic Apparatus

WAN Zhong-min,LIU Wei,ZHANG Liang,MING Ting-zhen
DOI: https://doi.org/10.3969/j.issn.1005-9490.2007.06.058
2007-01-01
Abstract:The miniature flat heat loop pipe (LHP) used for heat dissipation of electronic apparatus at high heat fluxes is presented, and its operational principle and advantages are analyzed. The mathematical model of porous wick, metal wall and fluid region of LHP evaporator are made, and the overall evaporator is solved with SIMPLE algorithm as a conjugate problem. The numerical results show that the miniature flat LHP is capable of transport large heat density for cooling of electronic apparatus, and the temperature of heated surface is low and the temperature distribution of heated surface is well. The side wall effect heat transfer limit existed in the miniature flat LHP evaporator is introduced, and its can dissipate heat about 17.5×104 W·m-2.
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