Rf Robustness Enhancement Through Statistical Analysis Of Chip-Package Co-Design

Xz Duo,Lr Zheng,H Tenhunen
DOI: https://doi.org/10.1109/ISCAS.2004.1328363
2004-01-01
Abstract:In order to enhance robustness of RF circuits, a flow of statistical analysis for chip-package co-design of RF system-on-package (SoP) is presented in this work. Methods for improving the yield of RF modules are developed. On-chip passive components versus off-chip passive components trade-offs in SoP module were also analyzed in terms of performance and yield. The design methods were demonstrated through case studies of LNA (low noise amplifier) in SoP.
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