Abstract:Stretchable electronics are of rapidly increasing interest due to their unique ability to function under complex deformations. Strain isolation of stiff functional components from the substrate represents a key challenge in the development of stretchable electronics since their mechanical mismatch may yield undesirable strains to degrade the device performance. The results presented here report an approach to develop a soft strain-isolating polymer substrate with programmable stiffness by spatioselective ultraviolet exposure for stretchable electronics. The approach being compatible with the well-established lithographic process reduces the fabrication complexity significantly and offers a simple yet robust strain-isolation mechanism to ensure the system stretchability of more than 100%. Combined experimental and numerical studies reveal the fundamental aspects of the design, fabrication, and operation of the strain-isolating substrate. Demonstration of this concept in a stretchable inorganic metal-based resistive temperature sensor and a stretchable organic photodiode array with unusually high performance shows the simplicity of the approach and the robustness in strain isolation in both component and device levels. This type of strain-isolation design not only creates promising routes for potential scalable manufacturing of stretchable electronics but also engineering opportunities for stretchable electronics involving the integration of various functional components, which require the quantitative control of the strain levels to achieve optimal performance.

Thermomechanical Analysis of Thin Films on Temperature-Dependent Elastomeric Substrates in Flexible Heterogeneous Electronics

Thermo-electro-mechanical instability of dielectric elastomers

Recent advances on thermal analysis of stretchable electronics

Thermomechanical Analysis of Film-On-Substrate System with Temperature-Dependent Properties

A simple analytical thermo-mechanical model for liquid crystal elastomer bilayer structures

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

Mechanics and Thermal Management of Stretchable Inorganic Electronics.

Recent Advances on Thermal Management of Flexible Inorganic Electronics

A PIECEWISE LINEAR MODEL FOR ANALYZING THIN FILM/SUBSTRATE STRUCTURE IN FLEXIBLE ELECTRONICS

One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin.

Conformal Theoretical Modeling of Arbitrary Shape Flexible Electronic Sensors Mounted Onto General Curved Surface Substrates

Theoretical and experimental investigations of transient thermo-mechanical analysis on flexible electronic devices

Soft Elastomers with Programmable Stiffness As Strain-Isolating Substrates for Stretchable Electronics.

Microstructure size-dependent contact behavior of a thermoelectric film bonded to an elastic substrate with couple stress theory

Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices

Piezothermoelastic analysis of thin films deposited on elastomeric substrates

Elastic and elastic-plastic analysis of multilayer thin films filled with heterogeneous materials

Flexible Electronics: Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (adv. Mater. 36/2009)

Finite Deformation Mechanics In Buckled Thin Films On Compliant Supports

Elasto-Plastic Design of Ultrathin Interlayer for Enhancing Strain Tolerance of Flexible Electronics

THERMOELASTIC ANALYSIS OF INTERFACIAL STRESS AND STRESS SINGULARITY BETWEEN A THIN FILM AND ITS SUBSTRATE