Research on Process Temperature During Chemical Mechanical Polishing of Stainless Steel Substrate

ZHENG Hai-feng,WEI Xin,XIE Xiao-zhu,YANG Xiang-dong,HU Wei
DOI: https://doi.org/10.13394/j.cnki.jgszz.2014.2.0005
2013-01-01
Abstract:Based on complex environment and temperature variation tendency during chemical mechanical polishing of the stainless steel substrate process temperature measurement system is designed and built The relationship between temperature and polishing parameter are obtained by experiments Results show that the temperature increases with the increase of polishing pressure and rotation speed of polishing pad but decreases with the increase of polishing solution rate The temperature near the edge of the surface is higher than that near the center Temperature increase on polyurethane pad is larger than those on synthetic leather and nubuck leather and temperature will fall significantly when there are grooves on the pad However there is no big difference between temperature increases of radical and circumferential grooves while grid groove has the smallest temperature changes Temperature increase becomes larger as the distance between grooves increases but the effect is relatively weak.
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