Abstract:The particular mechanistic role of halides in the additive-assisted copper electrodeposition is studied by means of combined potential/time transients, in situ STM (scanning tunneling microscopy) experiments, DFT (density functional theory) calculations and ICP-MS (inductively coupled plasma mass spectroscopy) analysis. More specifically, we studied the competitive interaction of bromide and SPS (bis-sodium-sulfopropyl-disulfide). The latter additive is commonly used in the Damascene process as specific antagonist (anti-suppressor, depolarizer) of the polyalkylene glycol (PAG) suppressor additives whereas halides are essential co-additives of the suppressors.Galvanostatic potential transient experiments indicate a substantial stabilization of the PAG suppressor complexes at the copper/electrolyte interface under reaction conditions when the chloride is displaced by the bromide in the formed PAG–Cu(I)–X (X=halide) ensemble. Those bromide containing suppressor complexes reveal substantially improved barrier properties with respect to inter-diffusion of cupric and cuprous ions. Furthermore they are more robust against degradation by the MPS (mercaptopropane sulfonic acid) which is formed under reactive conditions from the SPS as the actual anti-suppressor species in the course of a surface-confined SPS dissociation.Our combined STM and DFT work demonstrates that identical halide/MPS co-adsorption phases are formed when the SPS interacts with either the chloride or the bromide modified copper surfaces. The MPS production gets, however, substantially decelerated when the bromide is present. This effect is discussed as one important reason among others why the antagonistic interaction between the PAG suppressor ensembles and the SPS (MPS) is disturbed when the chloride is displaced by the bromide. We further demonstrate by means of an ICP-MS analysis the capability of the free MPS ligands to dissolve less soluble Cu(I) aggregates.

Synergistic Effect of Ethylene Thiourea and Bis-(3-sulfopropyl)-disulfide on Acid Cu Electrodeposition

Electrochemical Analysis of Cathode in TSV Copper Electroplating

Effect Of Bis-(3-Sulfopropyl) Disulfide And Chloride Ions On The Localized Electrochemical Deposition Of Copper Microstructures

Trace Bis-(3-sulfopropyl)-disulfide Enhanced Electrodeposited Copper Foils

Bis-(3-sulfopropyl) Disulfide Acceleration of Copper Electrodeposition via Molecular Dynamics and Quantum Chemical Calculations

An SERS study of the galvanostatic sequence employed for the electrochemical deposition of Copper in the fabrication of Interconnects

Bisphenol A Polyoxyethylene Ether Sodium Sulfate as a New Leveler for Electrodeposition of Copper

Effect of Sodium Dodecyl Sulfate on Copper Anodic Dissolution in Phosphoric Acid Solution

Effects of Fe(III) and Cu(I) on Electrodeposition and Microstructure Characterization for Acid Plating Bath

Electrocrystallization of Cu, Sn, and Сu-Sn alloys from sulfate electrolytes in the presence of thiourea and N -octylpyridinium bromide: Experimental and computational studies

Study the impact of CuSO4 and H2SO4 concentrations on lateral growth of hydrogen evolution assisted copper electroplating

Synergistic Effect of Different Additives on Microvia Filling in an Acidic Copper Plating Solution

Theoretical calculations and electrochemical investigation of additives in aqueous methanesulfonic acid for lead electrodeposition

On the role of halides and thiols in additive-assisted copper electroplating

Synergistic effects of additives on impurity residues in high-speed copper electrodeposition and voiding propensity in solder joints

Electrochemical and analytical study of electroplating additive in copper plating solution for microvia filling

Effect of hexamethylenetetramine on surface smoothness of electroplated copper coating

Investigation of the Effect of Electrodeposited Cu from Graphite Wrapped in Polypyrrole Film Formed by Chemical Oxidation

Leveling and Microstructural Effects of Additives for Copper Electrodeposition

[Electrochemical deposition of copper by using ionic liquids as additive and its surface-enhanced Raman scatting effect]

Effect of ultrasonic field on the mechanism of electrodeposited Cunucleation and growth