Low-temperature ozone passivation for improving the quality of sputtered HfOx thin-film

Shih-Ching Chen,Ting-Chang Chang,Hsuan-Hsiang Su,Po-Chun Yang,Jin Lu,Hui-Chun Huang,Der-Shin Gan,New-Jin Ho,Yi Shi
DOI: https://doi.org/10.1016/j.matlet.2009.05.074
IF: 3
2009-01-01
Materials Letters
Abstract:In this study, we proposed the low temperature (150 °C) oxygen (O2) and ozone (O3) treatments with a high pressure of 68 atm to improve the quality of sputtered hafnium-oxide (HfOx) thin-film dielectric. XPS results indicate that the binding energy of Hf-O became stronger and traps in dielectric film could be effectively passivated after the O2 and O3 treatments. The accumulation capacitance for the as-deposited HfOx sample can be improved from 261 pF to 303 pF and 366 pF for the O2 and O3 treated samples, respectively. The O3 treated sample also exhibits the negligible hysteresis phenomenon and slight flatband voltage shift.
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