Abstract:With the current explosive growth of communication technologies and a wide variety of applications being found for broadband and high frequency of electronic components, LTCC (Low Temperature Cofired Ceramics and Ferrites) with materials that possess special characteristics have been rapidly developed, due to its greater multifunctionality, higher performances, sub-miniaturization and excellent reliability. As one of the most important passive components, the chip inductor with high inductances used in high frequency has attracted significant interests in 3-D miniaturized systems. This paper focuses on the design and fabrication of a chip inductor based on the ZnTi-substituted hexaferrite BaFe12O19 by LTCC technology to realize the 0805 size of standard packaging for high frequency applications. Testing results show that the value of inductor is 2.45uH and cut-off frequency is 548MHz. And the measured results agree with the simulated data basically, which indicates that the samples can satisfy the need of high frequency inductors. The influences of each factor on the performances of inductor are also analyzed. It is an effective method to resolve the consistency problems between simulation and manufacture.

Design and Preparation of LTCC Band-pass Filter for Bluetooth Applications

Design of X-band Hi-Lo Microstrip Low-pass Filters

Design of band-pass filter on different materials in LTCC/LTCF technology

Design of multilayer triangular substrate integrated waveguide filter in LTCC

Broadband Filter Based on Stub-Loaded Ridge Substrate Integrated Waveguide (SIW) in Low Temperature Cofired Ceramic (LTCC)

Design of a Miniaturized Dual-Band Double-Folded Substrate Integrated Waveguide Bandpass Filter with Controllable Bandwidths

FDTD modeling of 3D metal-LTCC structures for RF(MM)ICs

Simulation Optimizing and Preparation of LTCC Multilayer Bandpass Filter

Compact LTCC balanced multicoupled line bandpass filter with enhanced stopband characteristic

Ultra-Low-Loss Millimeter-Wave LTCC Bandpass Filters Based on Flexible Design of Lumped and Distributed Circuits.

Compact cross-coupled circular cavity filters using multilayer substrate integrated waveguide

The design and fabrication of LTCC chip inductors for high frequency applications based on barium ferrites

Design of On-Chip Dual-Band Bandpass Filter Using Lumped Elements in LTCC Technology

Synthesis and Design of LTCC Filtering Balun With Wide Stopband

A Miniaturized C-B and SIW Bandpass Filter based on LTCC

Design Considerations and Implementation for Low Power Transconductance-Capacitance Filter with On-Chip Automatic Tuning

Design of a RF MEMS Passive LC Filter

Design of High-Temperature Superconducting Filter with Capacity-Coupled Feedlines

Design of Compact LC Lowpass Filters Based on Coaxial Through-Silicon Vias Array

A Novel Tri-Band Superconducting Filter Using Embedded Stub-Loaded Resonators

Design and performance of a compact forward-coupled HTS microstrip filter for a GSM system