Abstract:Interconnection structures made by Cu nanoparticles capped and stabilized by organics always have to be sintered to improve their electrical properties. To formulate a proper sintering process one has to be well aware of how the capping agent and the copper cores change with temperature. In this work, Cu nanoparticles capped by poly( vinylpyrrolidone) and sodium dodecyl sulfate have been synthesized and made into conductive thin films. Thermal analyses show that the Cu-organic composite nanoparticles are first oxidized at temperatures lower than 250 degrees C and then reduced in the temperature range of 300-420 degrees C by the organics and their decomposition products in Ar. The kinetic parameters of the reduction reaction have been determined. A sintering temperature of at least 450 degrees C is found to be necessary for complete decomposition of the organics and removal of the oxides. The effects of the sintering time, the heating rates, as well as the concentration of organics, on the microstructures and the electrical properties of the sintered films are also studied. The organic concentration in the films before sintering has to be carefully controlled in order to improve the electrical property of the copper films. By using an optimized preparing and sintering process, a film resistivity smaller than 1 x 10(-7) Omega m has been achieved. (C) 2015 Elsevier B.V. All rights reserved.

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