Abstract:The combined effects of thermomigration (TM) and electromigration (EM) were investigated in Cu/Sn3.0Ag0.5Cu/Ni solder joints by applying a 5×103A/cm2 DC current to the joints. With a thermal gradient, the Cu atoms and Ni atoms were found to migrate towards the lower temperature side while the Sn atoms were found to migrate towards the higher temperature side. For the solder joint stressed with a 5×103A/cm2 DC current, TM was found to play a dominant effect on the migration of Cu atoms in the solder because the Cu atomic flux in the solder which was induced by EM was smaller than that was induced by TM. The Ni atomic flux in the solder that was induced by TM was smaller than that induced by EM, but it could not be ignored because the values were the same order of magnitude. The Sn atomic flux induced by TM could be ignored due to its smaller magnitude than that induced by EM. The Cu3Sn IMC layer and Cu6Sn5 IMC layer at the Cu/solder interface in the joint with Cu as the anode were thicker than corresponding layers at the Cu/solder interface in the joint with Cu as the cathode. The IMC at the Ni/solder interface of joint with Cu as the anode was the Ni3Sn4 phase while that in the solder joint with Cu as the anode was the (Cu,Ni)6Sn5, and the former was thicker than the latter. EM and TM induced dissolution of the Ni3Sn4 IMC into the solder was found to be the main cause of the formation of voids at the Ni3Sn4/solder interface from a joint that used Cu as the anode. For the solder joint that used Cu as the anode, the Ni3Sn4 IMC layer at the Ni/solder interface was as thick as the Cu-Sn IMC layer at the Cu/solder interface. By contrast, for the solder joint that used Cu as the cathode, the IMC layer at the Ni/solder interface was thinner than that at the Cu/solder interf- - ace.

Evolution of Microstructure and Morphology of Eutectic SnBi Solder Joint During Electromigration Process at High Temperature

Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer

Electromigration and Thermomigration in Sn3Ag0.5Cu Solder Joints

The microstructure evolution and failure mechanism of Sn37Pb solder joints under the coupling effects of extreme temperature variation and electromigration

Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling

Microstructural evolution of Sn-9Zn-3Bi and Sn-9Zn-3Bi-0.3Cr solder under high-temperature and high-humidity conditions

The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints

Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures

The coupling effects of thermal cycling and high current density on Sn58Bi solder joints

Electromigration behavior of Sn–3.0Ag–0.5Cu/Sn–37Pb hybrid solder joints with various mixed percentages for aerospace electronics

Changes in the Microstructure and Electrical Resistance of SnBi-Based Solder Joints during Current Stressing

Investigation of Stress Evolution at the Interface of Cu/Sn3.0Ag0.5Cu/Cu Solder Joint during Electromigration

Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique

Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints

Bi Layer Formation at the Anode Interface in Cu/Sn-58Bi/Cu Solder Joints with High Current Density

The Effect of Bi Addition on the Electromigration Properties of Sn-3.0Ag-0.5Cu Lead-Free Solder

Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Synergistic effect of thermomigration and electric current stressing on damping capacity of Sn58Bi solder

Numerical Simulation of the Atomic Migration and Diffusion During Current Stressing in the Cu/Sn-58bi/Cu Solder Joints

Electromigration in Cu-Cored Sn-3.5Ag-0.7Cu Solder Interconnects under Current Stressing