Diffusion Bonding with A Powder Interlayer Between Bi-Sr-Ca-Cu-O Superconducting Tapes

Wang Yan-jun,Zou Gui-sheng,Bai Hai-lin,Wu Ai-ping,Guo Wei,Ren Jia-lie,Song Xiu-hua,Yi Han-ping,Zhang Hong-jie
DOI: https://doi.org/10.1166/jctn.2008.830
2008-01-01
Journal of Computational and Theoretical Nanoscience
Abstract:Using superconducting powder interlayer was an effective way for diffusion bonding of BSCCO tapes.The content of Bi-2223 superconducting phase influenced the quality of joints. The Critical Current Ratio (CCRo)raised 18% by using the interlayer with a content 88.5% of Bi-2223 superconducting phase instead of using the interlayer with a content 55%.Adding Ag to the superconducting powder interlayer could reduce the melting point of interlayer, increase the glutinosity of interlayer, reduce the defects of joints and get high quality joints at last.
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