Microstructural Evolution of Bi-2223/Ag Tapes During the Cooling Process after the First Heat Treatment

XP Chen,MY Li,TM Qu,Q Liu,Z Han
DOI: https://doi.org/10.1088/0953-2048/16/10/307
2003-01-01
Superconductor Science and Technology
Abstract:The microstructural evolution of Bi-2223/Ag tapes during cooling after the first heat treatment is investigated by SEM, XRD and EDS. Cooling was carried out after samples were heat treated at 840 °C for 10 h. Samples were quenched in air from different temperatures during the cooling process. Investigation showed that the volume fraction of Bi-2223 increased during the initial stages of cooling, reaching a maximum of 93% at 780 °C, and then began to decrease as the temperature fell below 780 °C. CuO particles precipitated out from the liquid phase and grew into big particles at temperatures below 750 °C. The Ca2PbO4 phase formed rapidly at the beginning of the cooling process, while the 3321 phase began to form only below 750 °C. The formation and amount of the lead-rich phases are associated with the amount of the liquid present at high temperatures.
What problem does this paper attempt to address?