Heat Transfer of Parallel Triangular Microchannels

SONG Yan-xi,XU Jin-liang,ZHANG Wei
DOI: https://doi.org/10.3969/j.issn.0253-2778.2007.03.010
2007-01-01
Journal of University of Science and Technology of China
Abstract:Based on the conventional Navier-Stokes theory,the whole silicon substrate was included as the computation domain and was simulated by the commercial package FLUENT.The numerical result was validated by comparing the calculated temperature field with the experimentally measured one.The results show that there is almost no difference between different microchannels in terms of flow rate.However,the influence of different side-wall heat flux cannot be neglected,especially at higher heat power input.In addition,the side-wall heat flux distribution on triangular microchannels is very uneven in contrast to that on rectangular microchannels,and axial conduction exerts a large impact on heat flux distribution.There is little difference between the result based on constant average temperature and that which is caculated using properties.
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