Abstract:A series of thermosetting siloxane-containing polyimide resins were synthesized by incorporating of bis(p-aminophenoxy)dimethylsilane or bis(p-aminophenoxy)tetramethyldisiloxane with various concentrations into formulated oligoimides. These thermosetting polyimide resins exhibited good combination of processability and thermal resistance. It was found that siloxane-containing oligoimides provided significant advantages over unmodified oligoimides, relative to melt fluidity and processing window, due to the flexibility of D[(CH3)2SiO2/2] siloxy units. The siloxane-containing polyimide resins cured at 380 °C revealed relatively higher glass transition temperatures (Tg) than that of unmodified polyimides, despite the incorporation of flexible siloxane segment in oligoimides. Dynamic mechanical analysis and microstructure investigation suggested that some D[(CH3)2SiO2/2] siloxy units in the surface layer of polyimide transformed into T[CH3SiO3/2] and Q[SiO4/2] siloxy units in the curing procedure besides crosslinking of phenylethynyl groups, due to oxidation crosslinking of siloxane. That led to inorganic silica-like structures formed in situ, and inter-connected by organic polyimide segments. This organic/inorganic hybrid characteristics endowed polyimide resins with enhanced thermal property. After post-curing at 450 °C, D[(CH3)2SiO2/2] siloxy units completely transformed into T[CH3SiO3/2] and Q[SiO4/2] siloxy units, and the polyimide reins gave the Tg even exceeding 550 °C. Meanwhile, the corresponding T700 carbon fiber reinforced composite presented excellent mechanical property and durability at the temperature as high as 500 °C.

Synthesis of Polyimide-Siloxane Copolymers and Their Properties

Silica/polyimide Hybrids and Their Dielectric Properties. I. Preparation with an Improved Sol–gel Process with Poly(amic Acid) As the Precursor

Synthesis of novel diaminosiloxane and it's polyimide

Synthesis and properties of semicrystalline copolyimides based on 4,4-diaminodiphenylether and 1,3-bis(4-aminophenoxy) benzene

Synthesis and characterization of copolyimides from bis(3, 4-dicarboxyphenyl)dimethylsilane dianhydride

Synthesis and Characterization of Biphenyl Polyimide Containing Alkyl Sulfide Structure

Melt fluidity and thermal property of thermosetting siloxane-containing polyimide resins and their organic/inorganic hybrid characteristics

Synthesis and Properties of Novel Thermoplastic Polyimide

Synthesis and Properties of Copolyimides Based on ODA/TPER

Synthesis and Characterization of Polyimides Derived from 5-Amino-2(p-aminophenyl) Benzoxazole Monomer

Synthesis and Properties Comparison of Low Dielectric Silicon Containing Polyimides.

Phenylethynyl-terminated Oligoimides Based on Bis(p-Aminophenoxy)dimethyl Silane: Effect of Siloxane Structure on Processability and Thermal Stability

Factors Influencing Thermal, Mechanical, Optical, And Adhesive Properties Of Segmented Poly(Imide Siloxane) Copolymers Films

Preparation,Processing and Thermal Properties of Naphthaleneethynyl-terminated Silica-containing Polyimides

Effects of Monomer Addition Sequences on the Properties of Silicon-Containing Copolyimides

Synthesis and Characterization of Soluble Polyimides Derived from a Novel Unsymmetrical Diamine Monomer: 1,4-(2′,4″-Diaminodiphenoxy)benzene

Comparative Study of Silicon‐containing Polyimides from Different Oxydianilines

Molecular Dynamics Simulation Study on the Structure and Properties of Polyimide/silica Hybrid Materials

Synthesis of a Silicon-Containing Aromatic Dianhydride and Its Polyimide

Organic–inorganic Polyimide Nanocomposites Containing a Tetrafunctional Polyhedral Oligomeric Silsesquioxane Amine: Synthesis, Morphology and Thermomechanical Properties

Synthesis and Characterization of Organsoluble Polyimide and Copolyimides from Alicyclic Dianhydride