Test Methods for MEMS Material Mechanical Properties

Zhang CHEN,Wei SU,Min WAN
DOI: https://doi.org/10.3969/j.issn.1671-4776.2007.06.009
2007-01-01
Abstract:With the rapid development of micro electro mechanical system(MEMS),mechanical properties of MEMS are being focused. Because of the miniature size,it is difficult to handle the microsample,impose load and measure displacement. Some of test techniques nowadays,such as nanoindentation,tensile testing,bulge test,microbeam bending test and wafer curvature measurement are discussed. The principles,advantages,shortcomings and the parameters of mechanical properties that could be measured by these methods are introduced.
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