Plasma-printing and Galvanic Metallization Hand in Hand——A New Technology for the Cost-efficient Manufacture of Flexible Printed Circuits

BAI Ya-xu,YUAN Zheng-xi,HE Wei,TANG Bai-yun
DOI: https://doi.org/10.3969/j.issn.1009-0096.2010.10.011
2010-01-01
Abstract:A new potentially cost-efficient technology combing patterned atmospheric pressure dielectric barrier discharge(DBD) treatment,here referred to as<plasma-printing>,and galvanic plating for the production of flexible printed circuits(FPC) is presented in this contribution.The technology is being jointly developed by partners from industry and academia,a major aim being the realization of the processes in a reel-to-reel production system.So far,plasma-printing experiments have been carried out using lab-scale batch plants.Using suitable plasma conditions and electroless plating baths,RFID-like tag and interdigital structure with line widths and spaces down to 100μm could already be produced.Adhesion of copper on DBD treated polyimide foil reached up to about 1N/mm,as was determined in a peel test similar to that described in the DIN53494.
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