Modification and Heat-Resistance of Hybrid Composite Containing Silicon and Acetylene Resin

王娜,周权,倪礼忠
DOI: https://doi.org/10.14133/j.cnki.1008-9357.2012.02.016
2012-01-01
Abstract:The silicon-containing poly(arylaeetylene) resin (GMD) was synthesized by condensation reac- tion. The curing mechanism and heat resistance were studied with DSC and TGA. Results showed that the temperature of 5% mass loss (Tds) of the cured GMD was 631℃ in nitrogen. The residual of mass was 59% based on the initial mass at 1 000 ℃. The flexural strength at room temperature of the composite was 324 MPa and the retention rate of flexural strength was 90% at 240 ℃. After heat treated for 7 rain at 500℃ in air, the retain ratio of the composite was 99.7%. The composite of which Tg was more than 400 ℃ possessed excellent high temperature-resistance properties, excellent mechanical and dielectric properties.
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