Curing Behavior of a Novel Polytriazole Resin
Liqiang Wan,Jianjun Tian,Jianzhi Huang,Yanhong Hu,Farong Huang,Lei Du
DOI: https://doi.org/10.1002/app.26852
IF: 3
2007-01-01
Journal of Applied Polymer Science
Abstract:The curing behavior of a novel low temperature curing polytriazole resin, prepared from p-xylylene diazide and N,N,N',N'-tetrapropargyl-p,p'-diaminodiphenylmethane, was investigated by DSC and rheological analyses. The kinetics of the curing of the resin was studied by nonisothermal and isothermal DSC measurements and the kinetics parameters were obtained. The values of apparent activation energy E, of the curing reaction obtained by nonisothermal and isothermal DSC are 80.7 and 75.3 kJ/mol, respectively. The curing of the resin was traced by the isothermal rheological analysis. The gelation times of the resin at 70, 75, 80, and 85 degrees C are about 200, 150, 110, and 75 min, respectively. The viscosity equation for the resin was found as follows: In eta = -107 + 33.5X10(3)/T + texp (26.3 + 9.87X10(3)/T) (C) 2007 Wiley Periodicals, Inc.