Effect of procedure conditions on characteristics of SnAgCu alloyed powder prepared by gas atomization

PENG Fen,MA Yun-zhu,CUI Peng,CHEN Shi-qi,LIU You-chang
DOI: https://doi.org/10.3321/j.issn:1004-0609.2009.06.016
2009-01-01
The Chinese Journal of Nonferrous Metals
Abstract:SnAgCu lead-free solder powders were prepared by close-coupled gas atomization. The effects of gas atomization pressure and melt superheat on the powder size and morphologies were investigated. Dry sieving was used to classify the alloyed powder. Laser light diffractometry and scanning electricity microscopy were used to characterize the size and morphologies of the powder. The results indicate that when the gas atomization pressure is 0.7 MPa and the melt superheat is 20-30 ℃ , the alloyed powder with mass medium diameter of 40.10 μm is obtained, which is satellite-free and high sphericity. When the superheat is 20-30 ℃, with the gas atomization pressure increasing from 0.7 MPa to 2.5-3.0 MPa, the powder size decreases from 40.10 μm to 32.22 μm whereas the surface defective of the powder increases obviously. When the gas atomization pressure is 0.7 MPa, with the melt superheat increasing from 30 ℃ to 50 ℃, the powder size decreases a little but the sphericity of the powder becomes worse. Rich Ag and Cu phase forms during quick cooling of gas atomization, disperses well in the Sn-matrix.
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