Analysis of stress in adhesive layer induced by polymerization shrinkage of composite resin using 3D finite element model

Chun-zheng FENG,Shou-liang ZHAO,Wei LIN,Yan-qiang HANG
DOI: https://doi.org/10.3969/j.issn.1005-2593.2006.05.006
2006-01-01
Abstract:AIM:To evaluate the stress distribution in adhesive layer induced by polymerization shrinkage of composite resin . METHODS: A disk with enamel, composite resin and adhesive layer was modeled by 3D finite element analysis.The shrinkage was simulated by means of temperature-dependent expansion. The effects of 6 different volumetric shrinkages and 2 different elastic moduli on stress of adhesive layer were analyzed. RESULT: High stress distribution in adhesive layer could be induced by volumetric shrinkage of composite resin. The higher of the volumetric shrinkage ,the higher stress in adhesive layer was produced. Higher elastic modulus led to higher stress distribution in adhesive layer. CONCLUSION: Polymerization shrinkage of composite resin has negative effect on bonding strength of adhesives.
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