Optimization of Photolithography Process on the Fine Structure of Surface-conduction Electron-emitter Display

Zhang Yongai,Guo Tailiang
DOI: https://doi.org/10.19453/j.cnki.1005-488x.2009.02.012
2009-01-01
Abstract:Spin coating and lithography technics effects on preparaing micro-structure of surface-conduction electron-emitter display are studied.Essential mechanism of positive photoresist and spin coating technology are analysed.The influences on lithorgraphy pattern from surface spin coating technics of photoresist,exposure dose and prebaking are discussed.Positive photoresist is coated on the surface of metal film-coated glass by spin coating technics and achieved by exposuring to UV lamp.The results were observed by dint of video microscope and profilometer and the optimal experiment technics is confirmed.It shows that the thickness of photoresist became thinner with the increase of spining speed and decrease of viscosity,the wideth of lithorgraphy pattern became narrower with the accretion of exposure dose.The lithorgraphy pattern is fine and regular under the condition of exposuring with 40-50 mJ/cm2 and prebaking at 110℃/25 min.The techniques can be applied to preparae fine structrue of SED.
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