Study on the Microstructure Evolution of Nano and Micron-size Thermal Barrier Coatings during Thermal Cycling

ZHOU Li,BAI Yu,TANG Jian-jiang,HAN Zhi-hai
DOI: https://doi.org/10.3969/j.issn.1674-7127.2013.01.004
2013-01-01
Abstract:The bond coatings were fabricated by Supersonic plasma spraying with NiCoCrAlY, the conventional and nano-structured YSZ thermal barrier coatings (TBCs) were prepared by Atmosphere plasma spraying(APS), the microstructure evolution laws of two different TBCs were compared under the thermal cycle conditions. The results show that there is lots of microcrack in the nano-structured coating with 15% void content because of incomplete melding of agglomerated nanopowder, while the void content of conventional coating is 10%. Under the loading of 300g, the micro-hardness of nano-structured coating is 776.1 and that of conventional coating is 606.9. Resillage appeared in these two coatings during the thermal cycle process and connected with each other as the number of cycles increasing, the width of crack was extended finally. Compare with nano-structured coating, the crack in conventional coating extended and broadened faster. Thermally grown oxide(TGO) in nano-structured coating grows faster because of the higher void content, then the stress between top coating and bond coating increasing, transverse crack ( parallelling with the interface between top coating and bond coating) appeared and extended, eventually resulted in coating failure with spalling.
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