Abstract:A series of thermosetting siloxane-containing polyimide resins were synthesized by incorporating of bis(p-aminophenoxy)dimethylsilane or bis(p-aminophenoxy)tetramethyldisiloxane with various concentrations into formulated oligoimides. These thermosetting polyimide resins exhibited good combination of processability and thermal resistance. It was found that siloxane-containing oligoimides provided significant advantages over unmodified oligoimides, relative to melt fluidity and processing window, due to the flexibility of D[(CH3)2SiO2/2] siloxy units. The siloxane-containing polyimide resins cured at 380 °C revealed relatively higher glass transition temperatures (Tg) than that of unmodified polyimides, despite the incorporation of flexible siloxane segment in oligoimides. Dynamic mechanical analysis and microstructure investigation suggested that some D[(CH3)2SiO2/2] siloxy units in the surface layer of polyimide transformed into T[CH3SiO3/2] and Q[SiO4/2] siloxy units in the curing procedure besides crosslinking of phenylethynyl groups, due to oxidation crosslinking of siloxane. That led to inorganic silica-like structures formed in situ, and inter-connected by organic polyimide segments. This organic/inorganic hybrid characteristics endowed polyimide resins with enhanced thermal property. After post-curing at 450 °C, D[(CH3)2SiO2/2] siloxy units completely transformed into T[CH3SiO3/2] and Q[SiO4/2] siloxy units, and the polyimide reins gave the Tg even exceeding 550 °C. Meanwhile, the corresponding T700 carbon fiber reinforced composite presented excellent mechanical property and durability at the temperature as high as 500 °C.

Synthesis of novel diaminosiloxane and it's polyimide

Synthesis of Polyimide-Siloxane Copolymers and Their Properties

Silica/polyimide Hybrids and Their Dielectric Properties. I. Preparation with an Improved Sol–gel Process with Poly(amic Acid) As the Precursor

Synthesis and Characterization of Biphenyl Polyimide Containing Alkyl Sulfide Structure

Synthesis and Characterization of a Novel Heat Resistant Epoxy Resin Based on N,N′-bis(5-hydroxy-1-naphthyl)pyromellitic Diimide

PREPARATION AND STUDY ON STRUCTURE OF THE POLYIMIDE/SILICA HYBRID AND NANOCOMPOSITE FILMS

Phenylethynyl-terminated Oligoimides Based on Bis(p-Aminophenoxy)dimethyl Silane: Effect of Siloxane Structure on Processability and Thermal Stability

Synthesis and Characterization of Novel Fluorinated Polyimides Derived from 4-Phenyl-2,6-bis[4-(4′-amino-2′-trifluoromethyl-phenoxy)phenyl]pyridine and Dianhydrides

Melt fluidity and thermal property of thermosetting siloxane-containing polyimide resins and their organic/inorganic hybrid characteristics

Preparation and characterization of aromatic polyimides derived from 4,4′-oxydiphthalic anhydride and 4,4′-diaminodiphenylmethane with different alkyl substituents

Synthesis and characterization of organosoluble ditrifluoromethylated aromatic polyimides

Design of novel silicon-containing alkynyl diamines and their related thermosetting polyimide resins

SYNTHESIS AND CHARACTERIZATION OF A POLYIMIDE CONTAINING PHENOLPHTHALEIN GROUPS

Novel Synthesis of Polyimide Foams with Aromatic and 1,6-Diaminohexane Imide Bonding

Synthesis, Characterization and Properties of Diamidodisilanes and Azocyclosilane

Preparation, Characterization And Selective Solubility Of Diels-Alder Addition Polyimides

Synthesis and properties of polyimides from a diamine containing side diphenylphosphine oxide and trifluoromethyl groups

Preparation and Properties of Highly Organosoluble Polyimides Derived from 2,2′-Disubstituted-4,4′-oxydianilines

Synthesis and Properties Comparison of Low Dielectric Silicon Containing Polyimides.

Solvent Resistant Self-Crosslinked Poly(ether Imide)

Synthesis and Characterization of Soluble Polyimides Derived from 4,4′‐diamino‐3,3′‐dimethyldiphenylmethane and Their Pervaporation Performances