Abstract:It is difficult to confirm the existence of intermetallic compounds (IMCs) between SnIn and Cu, as their atomic numbers are very close, making it challenging to differentiate them through experimental tests. In order to determine IMCs and understand their growth mechanism, this study employed phase identification, morphology observation, and growth kinetics analyses on IMCs formed between In-48Sn solder and polycrystalline Cu substrate during liquid soldering. The experiments were conducted within a temperature range of 160~250 °C for up to 90 min. The obtained results indicated that IMCs formed at the interface depended strongly on the soldering temperature. During long-time soldering below 200 °C, one main IMC species, Cu2(In,Sn), was found at the In-48Sn solder/Cu interface, which showed two different morphologies: a coarse-grained layer at the solder side and a fine-grained layer within the Cu component. When the soldering temperature was increased to 200 °C, Cu6(In,Sn)5 was the only intermetallic compound (IMC) that formed at the point where the In-48Sn/Cu eutectic interface existed. At 250 °C, with an increase in the soldering time, there was a formation of Cu9(In,Sn)4 between Cu and Cu6(In,Sn)5. The growth kinetics analyses indicated that the fast grain boundary/molten-channel diffusion of Cu into solder and their reaction with solder controlled the growth of the interfacial IMCs, with the activation energy of 24.56 kJ/mol when the sample was liquid-state-aged above 200 °C.

Formation of Intermetallic Compound (IMC) Between Sn and Co Substrate

Synthesis and Atomic Transport of CoSn3 NanoIMC by In Situ TEM

Microstructure and morphology of interfacial intermetallic compound CoSn 3 in Sn–Pb/Co–P solder joints

Sn/Co solid/solid interfacial reactions

Formation and Growth of Interfacial Intermetallic Layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni-W Substrates

Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate

Growth and evolution kinetics of intermetallic compounds in Sn-0.7Cu-10Bi-0.15Co/Cu interface

Effects of W contents on the solid-state interfacial reactions of Sn/Co-W

Formation Mechanism and Orientation of Cu3Sn Grains in Cu–Sn Intermetallic Compound Joints

Cu6Sn5 precipitation during Sn-based solder/Cu joint solidification and its effects on the growth of interfacial intermetallic compounds

Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples

Phase Equilibria of Sn-Co-Ni System and Interfacial Reactions in Sn/(Co, Ni) Couples

Cruciform Pattern Formation in Sn/Co Couples

Study on the metallurgical reaction law and mechanism of the Ni-xCu alloys/pure Sn solid-liquid interface

Interfacial Reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) Systems

IMC Growth at the Interface of Sn–2.0Ag–2.5Zn Solder Joints with Cu, Ni, and Ni–W Substrates

Evolution of CuSn Intermetallics Between Molten SnAgCu Solder and Cu Substrate

Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures

Study of Electroless Sn-coated Cu Microparticles and Their Application As a High Temperature Thermal Interface Material

Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate