Abstract:Sn–Co alloys are promising Pb-free solders, while plating layers and substrates of Ag and Cu are commonly encountered in electronic products. This study examines the interfacial reactions between Sn–0.25 wt% Co/Ag and Sn–0.25 wt% Co/Cu at 180 and 210 °C, with and without current stressing. CoSn 3 precipitates are found in the solder matrix in the as-prepared condition. In Sn–0.25 wt% Co/Ag couples, a continuous Ag 3 Sn reaction phase layer is observed at the interface and Ag 3 Sn phase particles are dispersed in the matrix, with and without current stressing. When there is a 500 A/cm 2 electrical current, the growth rate of the Ag 3 Sn phase is not affected at either the cathode side or the anode side. However, the passage of an electrical current leads to the formation of needle-like Ag 3 Sn phase particles in the solder matrix. In Sn–0.25 wt% Co/Cu couples, both Cu 6 Sn 5 and Cu 3 Sn reaction phases are formed at the interface, with and without current stressing. Cu 6 Sn 5 precipitates, with a higher Co content, are found in the matrix, mostly nucleated on CoSn 3 precipitates. When there is a 500 A/cm 2 electrical current stressing, all the reaction phase layers are thicker and the anode interfaces are nonplanar. It is observed that there is cracking and that there are discontinuous Cu 6 Sn 5 layers at the interface and that a significant amount of Cu 6 Sn 5 phase in the matrix accompanies 500 A/cm 2 electrical current stressing.

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Interfacial Reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) Systems

Directional Solidification and Liquidus Projection of the Sn-Co-Cu System

(Co,ni)/snse2 Interfacial Reactions (ii): Co/Snse2 and (co,ni)/snse2 Interfacial Reactions

ChemInform Abstract: Ordered CoSn‐Type Ternary Phases in Co3Sn3‐xGex.

Investigations on Interfacial Reactions at Reentrant Corners

Synthesis and Atomic Transport of CoSn3 NanoIMC by In Situ TEM

Phase Equilibria of Sn-Co-Cu Ternary System

Interfacial reactions with and without current stressing at Sn–Co/Ag and Sn–Co/Cu solder joints

Interfacial reactions of Sn-Cu/Ni couples at 250 degrees C

Interfacial Reactions in Sn–(Cu)/Cu6Sn5/Ni Couples at 210 °C

Interfacial Reactions in Sn-Ag/Co Couples

Interfacial reactions of Sn-Cu/Ni couples at 250 °C

Effects of Co Alloying and Size on Solidification and Interfacial Reactions in Sn-57 Wt.%bi-(Co)/cu Couples

Co/SnSe2 and (co,ni)/snse2 Interfacial Reactions

Interfacial Reactions in the Sn–20 At.% In/Cu and Sn–20 At.% In/Ni Couples at 160 °C