Extraction of electromechanical coupling coefficient of piezoelectric thin films deposited on substrates

Qing-Biao Zhou,Yue-kai Lu,Shu-Yi Zhang
DOI: https://doi.org/10.1016/S0041-624X(01)00062-2
IF: 4.2
2001-01-01
Ultrasonics
Abstract:A method to extract the electromechanical couplig coefficient kt2 of the thickness extensional mode of a piezoelectric thin film deposited on a substrate is presented, in which a two-layer structure is as a composite resonator. Based on the method proposed by Wang et al. (IEEE Trans. UFFC 46 (1999) 1327), we present two alternative approximate equations of kt2, then kt2 can be calculated directly from the effective electromechanical coupling factor keff2 of two special modes of the composite resonator. The new method is unnecessary to know the thickness of the piezoelectric film, which is very difficult to accuracy measure for a high frequency composite resonator or transducer. The accuracy and validity of this method are checked by numerical simulation on two typical samples. The results of numerical simulation show that the proposed approximate method is available for a real piezoelectric thin film, if the mechanical loss in the film is less than 5% and the mechanical loss in the substrate is less than 0.8%.
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