Constrained Plastic Deformation of Pressure Sensitive Polymers

Esteban P. Busso,I. George
DOI: https://doi.org/10.4028/www.scientific.net/KEM.118-119.27
1996-01-01
Key Engineering Materials
Abstract:This work addresses the local elasto-plastic fracture processes of pressure-sensitive polymers used as adhesive layers in microelectronics applications. Stress and deformation fields under mode I conditions for a cohesive crack embedded in a thin polymer layer are obtained using a new pressure-sensitive rate-independent constitutive material model for polyimide. Detailed computational analyses of a typical mode I delamination test specimen are performed to determine the highly constrained local deformation of the thin bonding layer. An investigation of the competing failure mechanisms revealed that a likely failure mode will consist of interfacial debonding at the site which develops the maximum traction. The low levels of hydrostatic pressure within the polymer suggest that no triaxiality-induced cavitation is Likely to occur in pressure sensitive adhesives obeying associated plastic flow. A relation is proposed which gives the fracture strength of the bond (or critical energy release rate for interface failure) in terms of the thickness of the bonding layer.
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