Abstract:We investigate the heel crack both in experimental and FEA simulation study for the 0.05mm～0.125mm aluminum wire.The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.With respect to the trend of lead free,the simulation is also processed under the three temperature hierarchies with different peak reflow temperature(220℃,240℃,260℃)and wetting time.From thermal stress and strain distributions,it can been seen that,during the fellow,the heel region of the wire is endured larger stress and plastic strain than other areas,and with the peak reflow temperature and wetting time increasing,the plastic strain also increases about 20%,which is very critical for material fatigue.

Study of Heel Crack in the Lead-Free Soldering for Power MOSFET Package