Study on the Strain and Temperature Densing Characterist ics of FBG Packaged by the Copper slice

Yu Xiujuan,Zhang Min,Lai Shurong
IF: 0.6
2006-01-01
ACTA PHOTONICA SINICA
Abstract:In this paper,the copper slice packaging technique fo r FBG sensor was developed in consideration of bare optical fiber being fragilit y,and then the strain and temperature characteristics of the packaged FBG sensor were experimentally and theoretically studied.Compared with the experimental re sults of the bare FBG,the strain sensing property of the FBG sensor packaged by the copper slice is nearly the same as that of the bare FBG,however the temperat ure sensing ability of the packaged FBG sensor is improved and the temperature s ensitivity coefficient is 2.78 times as much as that of the bare FBG.The strain and temperature resolution of the packaged FBG sensor are 1 με and 0.03℃.The packaged FBG sensors can be used easily in engineering.
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