Effect of currents on the microstructure of directionally solidified Al–4.5 wt% Cu alloy

Changjiang Song,Yuanyi Guo,Yunhu Zhang,Hongxing Zheng,Meng Yan,Qingyou Han,Qijie Zhai
DOI: https://doi.org/10.1016/j.jcrysgro.2011.03.025
IF: 1.8
2011-01-01
Journal of Crystal Growth
Abstract:This paper describes a comparative study on the effect of electric current pulse (ECP) and the semi-sinusoidal current (SSC) on the microstructure of directionally solidified Al–4.5wt% Cu alloy. The experimental results indicate that both ECP and SSC can make the convex solid/liquid interface flat, reduce the primary spacing and the depth of mushy zone, and change the interface morphology from cellular to planar (i.e. delay the planar/cellular transition). Under the same heating power, SSC produces a greater influence on the microstructure than ECP. Limited effect of the current direction on microstructure is also observed. Generally, current flowing from the liquid to the solid have a stronger effect on the microstructure than those from the solid to the liquid. Possible mechanisms by which the current altes the microstructure of Al–4.5wt% Cu alloy under directional solidification conditions are suggested.
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