Three-dimensional Finite Element Analysis Based Electromechanical Impedance Model and Its Application

CAI Jin-biao,CHEN Yong,YAN Wei
DOI: https://doi.org/10.3785/j.issn.1008-973x.2010.12.018
2010-01-01
Abstract:An accurate electromechanical impedance(EMI)finite element model was established for structural health monitoring,in order to check the existing structure theories for high-frequency impedance analysis and to verify the effectiveness of the damage detection method based on high-frequency electric impedance signals.The coupling interaction among piezoelectric patches,adhesive layer,and main structure was considered and the effect of adhesive layers on EMI signals was further taken into account.A three-dimensional finite element model was developed to simulate this coupled structural system using the software ANSYS and the correlative experimental study was conducted.Results showed that the harmonic analysis based on the three-dimensional finite element model could predict the vibration modes of the structure at high frequency,which agreed well with the experimental results,and the existing structure theories for high-frequency impedance analysis were effectively checked.Further study also showed that the EMI technique can feasibly detect small and local damages in structures.In addition,the location of structural damage can be determined through reasonable distribution of piezoelectric-ceramic patches.
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