Abstract:Y–Ba–Cu–O bulk superconductors were fast joined using Ag-doped Y–Ba–Cu–O solder (metallic Ag powder additive). The joining process was relatively shorter (around 24h) comparing with the traditional joining method. The microstructures and the superconducting properties of the joints were evaluated carefully. Microstructure analysis revealed that the crystal pattern in the joint was almost the same as that of the base material. This indicated that the bonding zone grew along the growth direction of the base material. The trapped-field distribution of the joined bulk was almost uniform and only single peak was found. This demonstrated that strong bonding was achieved in the joining process. The ratio of joined bulk’s levitation force to that of original base material was up to 93.5%.

Fast joining of melt textured Y–Ba–Cu–O bulks with high quality