CHEMORHEOLOGICAL BEHAVIOR AND CURE KINETICS OF SILICON-RYLACETYLENE-CONTAINING RESIN FOR RESIN TRANSFER MOLDING

齐会民,王春兰,高金淼,黄发荣,杜磊
DOI: https://doi.org/10.3969/j.issn.1003-0999.2009.06.017
2009-01-01
Abstract:Silicon-arylacetylene-containing resin (PSA-R) is applied in aerospace and electrical industries,which is suitable for resin transfer molding with high-temperature resistant,excellent dielectric constant,high-temperature mechanical property and processability. The cure kinetics of PSA-R resin was analyzed by using dynamic differential scanning calorimetry(DSC),and it was found that the cure of PSA-R resin followed an nth-order reaction mechanism. The reaction order was nearly two with activation energy of 110kJ·mol-1. The chemorheological behavior of PSA-R resin was studied with parallel plate viscosity spectrometer. A rheological mode based on the dual-Arrhenius equation was estabilished and used to simulate the rheological behavior of PSA-R resin. The model prediction determined from the dual-Arrhenius equation was in good agreement with experimental data.
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