Molecular Dynamic Simulations of Nano-indentation Processes for DLC Films on Silicon Nitride Substrate

Li Jun,Gu Le,Zheng Dezhi
DOI: https://doi.org/10.3969/j.issn.0254-0150.2012.09.005
2012-01-01
Abstract:The nano-indentation mechanisms for DLC films on β-Si3N4 substrate were investigated by molecular dynamic simulation.The rigid ball indenter and Tersoff potential function were used and the effects of the film density,film thickness,indentation depth,and substrate characteristics were considered.The results show that the compressive deformation capacity of the film is strengthened with the increasing film density,while weakened with the increasing film thickness.During indentation processes,the average atom potential energy transfers to kinetic energy and promotes the increasing of temperature in the contact area.Accordingly the number of sp3 bond and 5-coordinated atoms,also the computed hardness value of film are increased.The hardness of substrate orientation of β-Si3N4 affects the DLC film characteristics while the effects are weakened at higher thickness.The harder substrate will be better to the compressive deformation capacity of thin DLC films.
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