High Heat Load Tests on W/Cu Mock-Ups and Evaluation of Their Application to EAST Device

H. Li,J. L. Chen,J. G. Li,X. J. Sun

DOI: https://doi.org/10.1016/j.fusengdes.2007.12.013

IF: 1.905

2008-01-01

Fusion Engineering and Design

Abstract:Tungsten has been considered as the primary candidate plasma-facing materials (PFM) for the EAST device. Three actively cooled W/Cu mock-ups with an interlayer made of tungsten–copper alloy (1.5mm) were designed and manufactured. The tungsten armors, pure sintered tungsten plate (1mm) and plasma-sprayed tungsten coatings (0.3 and 0.9mm), were bonded to the interlayer by brazing and depositing respectively. All mock-ups can withstand high heat flux up to 5MW/m2 and no obvious failure was found after tests. The thermal performance experiments and microstructure analyses indicated the structure of mock-ups possess good thermal contact and high heat transfer capability. WCu alloy as an interlayer can largely reduce the stress due to the mismatch and improve the reliability. The mock-up with 0.9mm coating had the highest surface temperature than the other two mock-ups, delaminations of this mock-up were found in the near surface by SEM. The primary results show that pure sintered tungsten brazed to WCu alloy is a possible way, and thick plasma-sprayed coating technique still need to be improved.