Abstract:Thermal analysis has long been essential for designing reliable, high-performance, cost-effective integrated circuits (ICs). Increasing power densities are making this problem more important. Characterizing the thermal profile of an IC quickly enough to allow feedback on the thermal effects of tentative design changes is a daunting problem, and its complexity is increasing. The move to nanoscale fabrication processes is increasing the importance of quantum thermal phenomena such as ballistic phonon transport. Accurate thermal analysis of nanoscale ICs containing hundreds of millions of devices requires characterization of thermal effects on length scales that vary by several orders of magnitude, from nanoscale quantum thermal effects to centimeter-scale cooling package impact. Existing chip-package thermal analysis methods based on classical Fourier heat transfer cannot capture nanoscale quantum thermal effects. However, accurate device-level modeling techniques, such as molecular dynamics methods, are far too slow for use in full-chip IC thermal analysis. In this work, we propose and develop ThermalScope, a multi-scale thermal analysis method for nanoscale IC design. It unifies microscopic and macroscopic thermal physics modeling methods, i.e., the Fourier and Boltzmann transport modeling methods. Moreover, it supports adaptive multi-resolution modeling. Together, these ideas enable efficient and accurate characterization of nanoscale quantum heat transport as well as chip-package level heat flow. ThermalScope is designed for full-chip thermal analysis of billion-transistor nanoscale IC designs, with accuracy at the scale of individual devices. ThermalScope enables accurate characterization of temperature-related effects, such as variation in leakage power and delay. ThermalScope has been implemented in software and used for full-chip thermal analysis and temperature-dependent leakage analysis of an IC design with more than 150 million transistors. It will be publicly released for free academic and personal use.

Properties Of And Improvements To Time-Domain Dynamic Thermal Analysis Algorithms

Adaptive Multi-Domain Thermal Modeling and Analysis for Integrated Circuit Synthesis and Design

Heterogeneous Static Timing Analysis with Advanced Delay Calculator

Adaptive Chip-Package Thermal Analysis for Synthesis and Design

Temperature-aware microarchitecture

Thermal-Aware Small-Delay Defect Testing in Integrated Circuits for Mitigating Overkill

Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration

Regulating CPU Temperature With Thermal-Aware Scheduling Using a Reduced Order Learning Thermal Model

Self-Adapting Power Density Sampling for On-Chip Thermal Prediction With Transistor-Level Granularity

ThermalScope: Multi-Scale Thermal Analysis for Nanometer-Scale Integrated Circuits

Exploring Thermal Interface Materials for Electronics Via Molecular Dynamics Simulations: A Review

An Evaluation Framework for Dynamic Thermal Management Strategies in 3D MultiProcessor System-on-Chip Co-Design

A Thermal-Conscious Integrated Circuit Power Model and Its Impact on Dynamic Voltage Scaling Techniques

Parallel Space Adaptive Multigrid Method for IC Thermal Analysis

Thermal-Aware Feedback Control Scheduling for Soft Real-time Systems

Improving TAS Adaptability with a Variable Temperature Threshold

Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs with a Novel Adaptive Strategy Finite Element Method

A Method of Improving Time Integration Algorithm Accuracy for Long-Term Dynamic Simulation

General Parameterized Thermal Modeling for High-Performance Microprocessor Design

Unified Self-Heating Effect Model for Advanced Digital and Analog Technology and Thermal-Aware Lifetime Prediction Methodology

Ultrafast Temperature Profile Calculation in Ic Chips