Microscopic Bonding Mechanism of Welding Interface with Molten Cu–4Zn Deposited on Solid-State Steel

Hengzhi Wang,Kehong Wang,Rongkun Zheng,K. Satya Prasad,Simon P. Ringer
DOI: https://doi.org/10.1016/j.matchar.2007.04.002
IF: 4.537
2008-01-01
Materials Characterization
Abstract:An initial characterization was carried out on the heat affected zone between a 30CrMnSi steel and a Cu-4Zn (wt.%) alloy formed from a novel welding technique involving induction melting of a Cu alloy over a steel substrate at 1100 degrees C. A very thin (similar to 20 nm) reaction interface between the steel substrate and the Cu alloy is shown to play a key role in effecting these joints. This reaction interface is an Fe-Cu rich discrete phase with a FCC structure and substantial coherence to both the steel substrate and the Cu alloy layer. This reaction interface is expected to form under highly non-equilibrium conditions and provides a bridging effect for the join. This is proposed as the major reason for the strength and mechanical integrity of the weld. (C) 2007 Elsevier Inc. All rights reserved.
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