Polyphenylene Ether/Epoxy Resin Used for High Performance Copper Clad Laminate

Tian Yong,Pi Pihui,Wen Xiufang,Cheng Jiang,Yang Zhuoru
DOI: https://doi.org/10.3969/j.issn.1005-3360.2006.02.001
2006-01-01
Abstract:It briefly introduced the requirement of high performance copper clad laminate(CCL) for matrix resin,as well as the advantages and disadvantages of polyphenylene ether(PPE) and epoxy resins(EP) respectively used for the matrix resion of CCL.PPE/EP system exhibits an upper critical solution temperature(UCST) behavior.It discussed in detail the influencing effects of the molecular weight and the use amount of PPE,compatilizer and the modified PPE on the compatibility of PPE/EP system.The dielectric properties and heat resistance of the CCL(RG-200) prepared by PPE/EP system are much better than those of the conventional CCL(FR-4).
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