Abstract:The noticeable difference in the coefficient of thermal expansion (CTE) for polytetrafluoroethylene (PTFE) coatings and copper substrates is a major challenge for thermal debonding of the copper-clad laminate (CCL) in high-frequency communications. Theoretically, ceramic fillers with low CTEs in the coating can effectively reduce the gap, and there remains a trade-off between the dispersibility of fillers and the interfacial interactions with the polymeric matrix. Here, we propose a novel approach to prepare a pentafluorobenzoyl chloride (PFBC)-modified polydopamine (PDA) shell on silica particles by using amidation. Such modified particles perform excellent dispersion and exhibit diminished interfacial gaps in the PTFE matrix, which highly reduces CTE to 77 ppm/°C, accounting for only 48.1% of the neat coating. Moreover, the composite exhibits enhanced mechanical strength and toughness, and consequently suppresses thermal debonding in CCL under high-temperature conditions. Therefore, results present a promising potential for its use in the next-generation CCL of high-frequency communication devices.

What problem does this paper attempt to address?

The problem that this paper attempts to solve is the thermal debonding problem caused by the difference in coefficient of thermal expansion (CTE) between polytetrafluoroethylene (PTFE) coating and copper substrate, especially in high - frequency communication devices. Specifically: 1. **Mismatch of coefficient of thermal expansion**: The coefficient of thermal expansion of PTFE is approximately 109 ppm/°C, while that of copper is approximately 19 ppm/°C. This significant difference will lead to thermal stress when working for a long time under high - temperature conditions, thus causing the PTFE coating to peel off from the copper substrate. 2. **Trade - off between filler dispersibility and interface interaction**: In order to reduce the CTE of PTFE composites, ceramic fillers with low CTE are usually added. However, there is a trade - off between the dispersibility of these fillers in PTFE and the interface interaction with the polymer matrix. The ultra - low surface energy of PTFE makes the fillers easy to aggregate and the interface interaction is poor, which will affect the performance of the composites. To solve the above problems, the author proposes a new method, that is, to modify a layer of polydopamine (PDA) shell containing pentafluorobenzoyl chloride (PFBC) on the surface of silica particles through amidation reaction. These modified particles exhibit excellent dispersibility and reduce the interface gap in the PTFE matrix, thereby significantly reducing the CTE of the composites to 77 ppm/°C, which is only 48.1% of that of the pure PTFE coating. In addition, the composites also show enhanced mechanical strength and toughness, thus effectively suppressing the thermal debonding phenomenon under high - temperature conditions. Therefore, this research provides a potential application prospect for copper - clad laminate (CCL) in the next - generation high - frequency communication devices.

Fluorinated Polydopamine Shell Decorated Fillers in Polytetrafluoroethylene Composite for Achieving Highly Reduced Coefficient of Thermal Expansion

Improved dispersion and interfacial interaction of SiO2@polydopamine fillers in polytetrafluoroethylene composites for reduced thermal expansion and suppressed dielectric deterioration

Enhancing the dielectric and thermal properties of polytetrafluoroethylene-based composites through designing and constructing a novel interfacial structure

Development of a High‐Frequency Polytetrafluoroethylene (PTFE)‐Based Laminate With An Ultra‐Low Dielectric Constant by Combination of Ceramic Hollow Spheres and PTFE Resin

Surface-modified Li3Mg2NbO6 ceramic particles and hexagonal boron nitride sheets filled PTFE composites with high through-plane thermal conductivity and extremely low dielectric loss

Enhanced thermal conductivity and wear resistance of polytetrafluoroethylene via incorporating hexagonal boron nitride and alumina particles

A Rational Design of Core-Shell-satellite Structured BaTiO3 Fillers for Epoxy-Based Composites with Enhanced Microwave Dielectric Constant and Low Loss

Fluorine-terminated functionalized liquid metal/silicon carbide binary nanoparticles for polyvinyl alcohol composite films with high in-plane thermal conductivity and ultra-low dielectric constant

High-throughput finite-element design of dielectric composites for high-frequency copper clad laminates

Partially fluorinated metallic surface constructing robust, thermally conductive and electrically insulating polymer composite

Enhanced Dielectric Properties of Polyvinylidene Fluoride Nanocomposites Via Calcium Copper Titanate Nanofibers

Improved electrical resistivity-temperature characteristics of insulating epoxy composites filled with polydopamine-coated ceramic particles with positive temperature coefficient

Mechanical and Tribological Properties of Polytetrafluoroethylene Modified with Combined Fillers: Carbon Fibers, Zirconium Dioxide, Silicon Dioxide and Boron Nitride

Functionalized Al2O3 fillers/glass fibers cloth/PTFE composites with excellent thermal properties

Improved Tribological Performance of Polydopamine/Polytetrafluoroethylene Thin Coatings With Silica Nanoparticles Incorporated into the Polydopamine Underlayer

Properties of polyphenylene sulphide/glass fibre composites with negative thermal expansion ceramic fillers

High Dielectric Constant Composite Of P(Vdf-Trfe) With Grafted Copper Phthalocyanine Oligomer

Polymer Composite with Enhanced Thermal Conductivity and Insulation Properties through Aligned Al2O3 Fiber

Optimizing thermal and dielectric properties of ethylene-tetrafluoroethylene (ETFE)/h-BN composites via interface engineering: activation of C–F bonds on ETFE for surface grafting

Improved Dielectric Properties and Thermal Conductivity of PVDF Composites Filled with Core–shell Structured Cu@CuO Particles

Improved coefficient thermal expansion and mechanical properties of PTFE composites for high-frequency communication