Abstract:Dielectric composites with low dielectric constants ( ε ), low dielectric loss (tan δ ), and excellent thermal-mechanical stability are highly desired for high signal transmission speed and high device integration. Polytetrafluoroethylene (PTFE) based composites exhibit tremendous potential due to the outstanding dielectric properties and high-frequency stability of PTFE. However, achieving PTFE-based dielectric composites with thermal-mechanical stability and low dielectric constant is challenging. Herein, we develop a glass fiber/polytetrafluoroethylene (GF/PTFE) composite for high-frequency communication applications with a designed skeleton structure. By the paper-making process, the glass fiber can be dispersed in random directions to set up a skeleton with the PTFE matrix entering the space in the fiber network. The modification of GF was also carried out to low down the dielectric loss of the composite. Benefiting from the supporting effect of the skeleton structure and surface modification, the thermal-mechanical stable dielectric composite was achieved with a low dielectric constant, and dielectric loss remained (m-GF content = 15 wt%, ε  = 2.326 and tan δ  = 5.24 × 10−3 at 30 GHz, xy-CTE = 29 ppm/°C and z-CTE = 47 ppm/°C). Moreover, the composites also have good dielectric constant frequency stability and thermal conductivity. Thus, this work provided an effective way to tailor the structure of functional composites with disordered fiber fillers.

Improved coefficient thermal expansion and mechanical properties of PTFE composites for high-frequency communication

Enhancing the dielectric and thermal properties of polytetrafluoroethylene-based composites through designing and constructing a novel interfacial structure

Investigation of PTFE-based ultra-low dielectric constant composite substrates with hollow silica ceramics

Surface-modified Li3Mg2NbO6 ceramic particles and hexagonal boron nitride sheets filled PTFE composites with high through-plane thermal conductivity and extremely low dielectric loss

Improved dispersion and interfacial interaction of SiO2@polydopamine fillers in polytetrafluoroethylene composites for reduced thermal expansion and suppressed dielectric deterioration

Improved properties of PTFE composites filled with glass fiber modified by sol–gel method

High-throughput finite-element design of dielectric composites for high-frequency copper clad laminates

Surface-modified Zn0.5Ti0.5NbO4 particles filled polytetrafluoroethylene composite with extremely low dielectric loss and stable temperature dependence

Modified poly(phenylene oxide)/(CaSr)TiO 3 composites with ultrahigh permittivity and low loss for microwave substrates

Glass fiber/polytetrafluoroethylene composite with low dielectric constant and thermal stability for high-frequency application

Medium Dielectric Constant And Low-Loss Ptfe Composites Filled With Mgo-Lif Co-Doped Li2tio3 Particles

Properties of polyphenylene sulphide/glass fibre composites with negative thermal expansion ceramic fillers

Functionalized Al2O3 fillers/glass fibers cloth/PTFE composites with excellent thermal properties

Enhancing Thermal Conductivity of hBN/SiC/PTFE Composites with Low Dielectric Properties via Pulse Vibration Molding

Process and Microstructure to Achieve Ultra-high Dielectric Constant in Ceramic-Polymer Composites

Effects of particle size distribution of silica on properties of PTFE/SiO2 composites

Modified BCZN Particles Filled PTFE Composites with High Dielectric Constant and Low Loss for Microwave Substrate Applications

Flexible BaTiO3/SiC@PbTiO3/epoxy composite films with enhanced dielectric performance at high frequency

Microstructure and dielectric properties of (Ba0.6Sr0.4)TiO3/PEEK functional composites prepared via cold-pressing sintering

Dielectric and thermal properties of GFs/PTFE composites with hybrid fillers of Al2O3 and hBN for microwave substrate applications

Fabrication and the film-forming mechanism of thin polytetrafluoroethylene films with enhanced dielectric and mechanical properties