Curing behavior and mechanical properties of DGEBA/PA/DDM systems

PI Pi-hui
2011-01-01
Abstract:The effect of DDM amounts on the curing process of epoxy resin/polyamide 651 system was investigated by the non-isothermal DSC and the tensile strength test.The apparent activation energy and the order of reaction were calculated and the curing process parameters of adhesives were determined.The results showed that the heat release of the curing reaction of the adhesives with 14% DDM(based on the weight of epoxy resin)reached the maximum.The activation energy was 53.654 kJ/mol and the reaction order was 0.895.The best initial curing temperature,peak temperature and the end temperature were 40 ℃,85 ℃and 120 ℃,respectively.The tensile strength of the systems with 14% DDM was increased by about 50%.
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