The Effect of Substrate Surface on the Physical Properties of SnS Films

M. Devika,N. Koteeswara Reddy,K. Ramesh,H. R. Sumana,K. R. Gunasekhar,E. S. R. Gopal,K. T. Ramakrishna Reddy
DOI: https://doi.org/10.1088/0268-1242/21/10/024
IF: 2.048
2006-01-01
Semiconductor Science and Technology
Abstract:The effect of substrates on the physical properties of tin mono-sulphide (SnS) films has been studied. The SnS films were deposited using the resistive thermal evaporation method on CORNING 7059 glass, ITO-coated glass, Si wafer and Ag-coated glass substrates. The as-deposited films exhibited nearly stoichiometry between Sn and S elements with a Sn/S at.% ratio of similar to 1.05. Structural analysis of these films indicated that the films are crystallized in the form of an orthorhombic crystalline structure and showed ( 1 1 1) as a dominant peak, except for the films grown on Si substrates. Si/SnS films exhibited ( 0 4 0) as a dominant peak. The ITO/SnS films showed high values of rms roughness (similar to 14.9 nm) and average grain size (similar to 225 nm), along with a low electrical resistivity of 8.9 x 10(-3) Omega cm as compared to SnS films grown on glass, Si and Ag substrates. The ITO/SnS films exhibit low resistivity, probably due to the large size of grains, and could be suitable for optoelectronic device applications.
What problem does this paper attempt to address?