Si-Based Ge Quantum Dot Infrared Photodetectors with Si_3N_4 as Anti-Reflection Coating

WEI Rong-shan,DENG Ning,WANG Min-sheng,ZHANG Shuang,CHEN Pei-yi,LIU Li-tian,ZHANG Jing
DOI: https://doi.org/10.3969/j.issn.1004-1699.2006.05.122
2006-01-01
Abstract:20-stacked Ge quantum dot infrared photodetectors (QDIPs) with Si_3N_4 as anti-reflection coating are investigated. Ge quantum dots were grown on Si(100) by gas source molecular beam epitaxy (GSMBE). Then p-i-n structure quantum dot infrared photodetectors were fabricated based on the materials. To improve absorptivity, then responsivity of QDIPs, transfer matrix method was used to calculate the absorptivity(at 1.31 μm) for different thickness of Si_3N_4 anti-reflection coating. The simulation results showed that 185nm thickness of Si_3N_4 provided higher absorptivity. Then 185nm Si_3N_4 as anti-reflection coating was grown by PECVD on top of the device. At room temperature, a photocurrent responsivity of 8.5mA/W was achieved at 1.31 μm. Compared to the same structural devices without anti-reflection coating, the responsivity was greatly improved by a factor of 30.
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