Abstract:Due to the high integration on vertical stacked layers, power/ground network design becomes one of the critical challenges in 3D IC design. With the leakage-thermal dependency, the increasing on-chip temperature in 3D designs has serious impact on IR drop due to the increased wire resistance and increased leakage current. Power/ground (P/G) TSVs can help to relieve the IR drop violation by vertically connecting the on-chip P/G networks on different layers. However, most previous work only fulfills a margin of the full potential of PG TSVs planning since the P/G grids are restricted in a uniform topology. Besides, the overlook of resistance variation and leakage current will make the results less accurate. In this paper, we present an efficient thermal-aware P/G TSVs planning algorithm based on a sensitivity model with temperature-dependent leakage current considered. The proposed method can overcome the limitation of uniform P/G grid topology and make full use of P/G TSVs planning for the optimization of P/G network by allowing short wires to connect the P/G TSVs to P/G grids in non-uniform topology. Moreover, with resistance variation and increased leakage current caused by high temperature in 3D ICs, more accurate result can be obtained. Both the theoretical analysis and experimental results show the efficiency of our approach. Results show that neglecting thermal impacts on power delivery can underestimate IR drop by about 11%. To relieve the severe IR drop violation, 51.8% more P/G TSVs are needed than the cases without thermal impacts considered. Results also show that our P/G TSV planning based on the sensitivity model can reduce max IR drop by 42.3% and reduce the number of violated nodes by 82.4%.

Floorplanning with IR-drop Consideration

SoC Floorplanning with IR-drop Consideration

Floorplanning considering IR drop in multiple supply voltages island designs

A novel cross-layer framework for early-stage power delivery and architecture co-exploration.

A Fast OPC Algorithm for IC Layout Based on 1-D Cells after Optimization of Gap Distribution

Floorplan and Power/Ground network co-design using guided incremental floorplanning

A Cross-Layer Approach for Early-Stage Power Grid Design and Optimization.

Thermal-aware Power Network Design for IR Drop Reduction in 3D ICs.

A Criticality-Driven Microarchitectural Three Dimensional (3D) Floorplanner

A thermal-driven force-directed floorplanning algorithm for 3D ICs

Thermal-aware P/G TSV Planning for IR Drop Reduction in 3D ICs

Floorplanning Challenges in Early Chip Planning

3D-STAF: Scalable Temperature and Leakage Aware Floorplanning for Three-Dimensional Integrated Circuits

RLPlanner: Reinforcement Learning based Floorplanning for Chiplets with Fast Thermal Analysis

Reallocation and Rescheduling after floor-planning for timing optimization

A Novel Frequency Constrained Floorplanning Algorithm

FIDER: A Force-Balance-Based Interconnect Delay Driven Re-Synthesis Algorithm for Data-Path Optimization After Floorplan

Incremental I/O Planning with White Space Redistribution for Flip-Chip Design

2.5d Floorplan Based Annealed Neural Networks For Circuit Partitioning

Ps-Fpg: Pattern Selection Based Co-Design Of Floorplan And Power/Ground Network With Wiring Resource Optimization

Fast voltage drop modeling of power grid with application to silicon interposer analysis