Abstract:3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integration techniques such as face-to-face wafer bonding with sub-10 $\mu$m pitch can enable new ways of designing SoCs using all 3 dimensions, like folding a microprocessor design across multiple 3D tiers. However, overlapping thermal hotspots can be a challenge in such 3D stacked designs due to a general increase in power density. In this work, we perform a thorough thermal simulation study on sign-off quality physical design implementation of a state-of-the-art, high-performance, out-of-order microprocessor on a 7nm process technology. The physical design of the microprocessor is partitioned and implemented in a 2-tier, 3D stacked configuration with logic blocks and memory instances in separate tiers (logic-over-memory 3D). The thermal simulation model was calibrated to temperature measurement data from a high-performance, CPU-based 2D SoC chip fabricated on the same 7nm process technology. Thermal profiles of different 3D configurations under various workload conditions are simulated and compared. We find that stacking microprocessor designs in 3D without considering thermal implications can result in maximum die temperature up to 12°C higher than their 2D counterparts under the worst-case power-indicative workload. This increase in temperature would reduce the amount of time for which a power-intensive workload can be run before throttling is required. However, logic-over-memory partitioned 3D CPU implementation can mitigate this temperature increase by half, which makes the temperature of the 3D design only 6$^\circ$C higher than the 2D baseline. We conclude that using thermal aware design partitioning and improved cooling techniques can overcome the thermal challenges associated with 3D stacking.

Thermal-aware Task Scheduling in 3D Chip Multiprocessor with Real-Time Constrained Workloads

Real-Time Constrained Task Scheduling in 3D Chip Multiprocessor to Reduce Peak Temperature

Thermal-Aware Task Scheduling for 3D Multicore Processors.

Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management

Three-dimensional Multiprocessor System-on-chip Thermal Optimization

Temperature-aware Task Scheduling Heuristics on Network-on-Chips

An Evaluation Framework for Dynamic Thermal Management Strategies in 3D MultiProcessor System-on-Chip Co-Design

Power Supply Noise Aware Task Scheduling on Homogeneous 3D MPSoCs Considering the Thermal Constraint

System-Level Analysis of 3D ICs with Thermal TSVs

Algorithms for Temperature-Aware Task Scheduling in Microprocessor Systems

Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology

Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration

Cyber-Physical Thermal Management of 3D Multi-Core Cache-Processor System with Microfluidic Cooling

A Full Chip Scale Numerical Simulation Method for Thermal Management of 3D IC

Energy Conscious Dynamic Window Scheduling of Chip Multiprocessors

Three-Dimensional Integrated Circuits Design for Thousand-Core Processors: From Aspect of Thermal Management

A Fast and Low Computation Consumption Model for System-Level Thermal Management in 3D IC

Thermal-aware application mapping using genetic and fuzzy logic techniques for minimizing temperature in three-dimensional network-on-chip

Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation.

Regulating CPU Temperature With Thermal-Aware Scheduling Using a Reduced Order Learning Thermal Model

Dynamic Thermal Management for 3-D ICs with Time-Dependent Power Map Using Microchannel Cooling and Machine Learning