Bonding of CVD diamond thick films using an Ag–Cu–Ti brazing alloy

Fenglian Sun,Jicai Feng,Dan Li
DOI: https://doi.org/10.1016/S0924-0136(01)01005-6
IF: 6.3
2001-01-01
Journal of Materials Processing Technology
Abstract:The bonding of chemical vapor deposition (CVD) thick films diamond was performed by an active metal brazing technique. A brazing filler metal 92 (72Ag–28Cu)–8Ti alloy was used under controlled temperature and time.
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