A Fast 3D-BSG Algorithm for 3D Packing Problem

Lingyi Zhang,Sheqin Dong,Xianlong Hong,Yuchun Ma
DOI: https://doi.org/10.1109/iscas.2007.378499
2007-01-01
Abstract:3D packing is a fundamental problem for VLSI design. It arises from 3D-ICs floorplan design and task schedule in reconfigurable FPGA design. In this paper, we present a novel 3D floorplan representation by improving the 3D bounded slice-surface grid (3D-BSG) structure in two aspects: (1) optimize the evaluation time complexity from O(n3) to O(n2) by using three block relation graphs; (2) handle the infeasible assignment problem of 3D-BSG in linear time by giving the rule of null relation rooms. The effectiveness and efficiency of the fast 3D-BSG are shown by both theoretical analysis and experimental results. The average speedup compared to the original 3D-BSG is 44times high.
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