Improved Performance of Diode-End-Pumped Nd:Gdvo4 912 Nm Laser Property with Indium Solder Technology

R. P. Yan,X. Yu,D. Y. Chen,F. Chen,X. D. Li,Y. F. Ma,C. Wang,J. H. Yu
DOI: https://doi.org/10.1134/s1054660x1105029x
IF: 1.2
2011-01-01
Laser Physics
Abstract:A novel indium-solder technology is demonstrated to deal with the serious thermal dissipation problem in the 912 nm Nd:GdVO4 laser operation. By use of indium-solder between the laser rod and the heat-sink, the contact resistance is reduced by removing the air bubble and heat conducting silicon and the boundary heat transfer coefficient is raised. After the indium-solder was used, it is found that the temperature in the laser rod and the deformation in the pumping end surface are eased remarkably based on a simulation of finite element analysis. Experimental results show that the continuous-wave 912 nm laser performance is improved obviously, both in a plano-plano cavity and a plano-concave cavity.
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